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VND10N0613TR

STMicroelectronics

VND10N0613TR by STMicroelectronics

VND10N0613TR from STMicroelectronics is a compact MOS peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It features a nominal output peak current limit of 10 A and fast turn-on/off times of 1.8 µs and 2.3 µs, respectively. Ideal for buffer or inverter applications, it ensures reliable performance in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 44,500 parts In-Stock

1+ parts

-

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44,500

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Digiode

USA . 3,406 parts In-Stock

1+ parts

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3,406

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Vyrian

USA . 2,923 parts In-Stock

1+ parts

-

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2,923

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Digital Electronic Gebert Verwaltungs UG

Germany . 2,300 parts In-Stock

1+ parts

-

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-

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2,300

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-

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Anansix

USA . 1,756 parts In-Stock

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1,756

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$2.595

100+ parts

$2.361

1k+ parts

$2.128

10k+ parts

-

450

$2.595

$2.361

$2.128

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IDEA Electronic Components Group

UK . 2,024 parts In-Stock

1+ parts

$10.017

100+ parts

-

1k+ parts

$9.015

10k+ parts

-

2,024

$10.017

-

$9.015

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AZTECH Wire

Italy . 563 parts In-Stock

1+ parts

$18.090

100+ parts

-

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563

$18.090

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MKK Technologies

India . 1,768 parts In-Stock

1+ parts

$18.836

100+ parts

-

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1,768

$18.836

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DigiPath Technology Company

USA . 1,768 parts In-Stock

1+ parts

$18.836

100+ parts

-

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1,768

$18.836

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Kepictronics

USA . 103,321 parts In-Stock

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103,321

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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A-Z Elektronik GmbH

Germany . 4,758 parts In-Stock

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4,758

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Corphita

USA . 4,099 parts In-Stock

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4,099

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Microchip USA

USA . 4,077 parts In-Stock

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4,077

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Parana Technologies

USA . 1,158 parts In-Stock

1+ parts

-

100+ parts

$11.977

1k+ parts

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10k+ parts

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1,158

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$11.977

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Overview

Unlock the potential of your projects with the VND10N0613TR from STMicroelectronics—a leader in innovative solutions. This versatile peripheral driver combines robust performance with advanced protection features, ensuring reliability and efficiency in diverse applications. Designed for seamless integration, its compact size and quick response times empower you to create cutting-edge electronics with ease. Elevate your designs and trust in ST's legacy of quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection from environmental factors, ensuring that the product remains reliable under varied conditions.

Surface Mount: YES

Surface mount compatibility enables easy and efficient integration into modern circuits, making assembly more streamlined.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for higher density packing of components.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Integrated protections enhance the safety and longevity of the device, minimizing the risk of damage from unexpected electrical conditions.

No. of Terminals: 2

A simple 2-terminal design simplifies connections, reducing complexity in circuit design and facilitating easier troubleshooting.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for compact designs, ensuring that it fits in space-constrained applications without sacrificing performance.

Terminal Position: SINGLE

Single terminal positioning allows for straightforward circuit layout, making it easier for designers to implement in various applications.

Maximum Seated Height: 2.63 mm

A low profile of 2.63 mm allows for better clearance in compact environments, making it suitable for slim devices.

Width: 6.1 mm

A width of 6.1 mm is compatible with a wide range of PCB layouts and designs, offering flexibility in placement.

Length: 6.5 mm

The length of 6.5 mm strikes a balance between performance and compactness, fitting well into various electronic assemblies.

Technology: MOS

MOS technology ensures high efficiency and fast switching speeds, making this product suitable for rapid signal processing applications.

Terminal Form: GULL WING

Gull wing terminals provide stable soldering connections, enhancing reliability and performance during operation.

Turn-on Time: 1.8 us

A fast turn-on time of 1.8 microseconds enhances responsiveness, making this driver ideal for high-speed applications.

Terminal Pitch: 2.25 mm

A 2.25 mm terminal pitch facilitates easier integration into PCB designs and improves manufacturability.

Nominal Output Peak Current Limit: 10 A

A peak current limit of 10 A provides sufficient drive capability for a variety of peripherals, ensuring reliable operation under load.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This driver type is versatile, suitable for both buffering and inverting signals, making it adaptable to different circuit requirements.

Turn-off Time: 2.3 us

Quick turn-off time of 2.3 microseconds ensures efficient operation and minimizes signal delay, enhancing overall circuit performance.

Output Current Flow Direction: SINK

Sink output current flow allows for efficient control of connected devices, making it a preferred choice for many peripheral applications.

Technical Specifications

Peripheral Drivers VND10N0613TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.63 mm

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

2.25 mm

Terminal Position:

SINGLE

Turn-off Time:

2.3 us

Turn-on Time:

1.8 us

Width:

6.1 mm

Trade Compliance

VND10N0613TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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