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TDA9111

STMicroelectronics

TDA9111 by STMicroelectronics

TDA9111 by STMicroelectronics is a versatile Horiz/Vert Deflection IC designed for monitors. It operates with power supplies of 4.5-5.5V, features a compact 32-terminal package, and withstands temperatures from 0 °C to 70°C. Ideal for enhancing display performance in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,172 parts In-Stock

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Anansix

USA . 1,449 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 960 parts In-Stock

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Vyrian

USA . 871 parts In-Stock

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Resion

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Prism Electronics

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LittleDiode

UK . 5 parts In-Stock

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GES GmbH

Germany . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 1,628 parts In-Stock

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$2.815

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$2.534

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MKK Technologies

India . 1,272 parts In-Stock

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$5.294

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DigiPath Technology Company

USA . 1,272 parts In-Stock

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Perfect Parts

USA . 95,917 parts In-Stock

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GreenTree Electronics

Israel . 82,650 parts In-Stock

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 5,747 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,453 parts In-Stock

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Corphita

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Glotronic Ltd.

UK . 383 parts In-Stock

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Parana Technologies

USA . 248 parts In-Stock

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Elevate your display technology with the TDA9111 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality Vertical Deflection IC ensures exceptional performance and reliability, ideal for monitors that demand precision. With its robust design, it operates seamlessly across various applications, offering enhanced image stability and clarity. Choose the TDA9111 to unlock superior visual experiences and enjoy the peace of mind that comes with STMicroelectronics' trusted reputation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials offers good durability and resistance to environmental factors, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on circuit boards, facilitating compact designs.

General IC Type: HORIZ/VERT DEFLECTION IC

Being a horizontal/vertical deflection IC ensures optimized performance in monitor applications, providing clear and precise image rendering.

Power Supplies (V): 5, 12

Supports dual power supply voltages, offering flexibility in various electronic designs while accommodating different application requirements.

No. of Terminals: 32

A higher number of terminals allows for greater functionality and connectivity, enabling complex circuit integration.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style ensures efficient use of board space and ease of handling during assembly.

Application: MONITOR

Specifically designed for monitor applications, ensuring optimized performance and reliability for display systems.

Maximum Operating Temperature: 70 °C

A max operating temperature of 70 °C ensures reliability in typical commercial environments, reducing the risk of thermal failure.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this IC can operate effectively in a wide range of environmental conditions.

Terminal Position: DUAL

Dual terminal position enhances ease of soldering and provides options for layout design flexibility.

Maximum Seated Height: 5.08 mm

A low seated height profile aids in maintaining a low center of gravity on PCBs, improving overall system stability.

Width: 10.16 mm

Standard width facilitates compatibility with a wide range of PCB layouts and designs.

Minimum Supply Voltage (Vsup): 4.5 V

Minimum supply voltage requirement allows for operation even in lower voltage scenarios, adding flexibility in circuit design.

Length: 27.94 mm

Optimal length allows for easy integration into various circuit designs while fitting standard PCB dimensions.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures the IC meets the quality standards required for consumer electronics applications.

Technology: BICMOS

The BICMOS technology combines the benefits of bipolar and CMOS, offering low power consumption along with high speed.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust physical connections, suitable for demanding applications and easy soldering.

Terminal Pitch: 1.778 mm

Standard terminal pitch ensures compatibility with many circuit designs and simplifies PCB layout.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage capability of 5.5 V allows for versatile integration across a range of electronic applications.

Technical Specifications

Vertical Deflection ICs TDA9111 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 10.8V TO 13.2V SUPPLY

Application:

MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T32

Length:

27.94 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5,12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TDA9111 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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