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TDA9109/SN

STMicroelectronics

TDA9109/SN by STMicroelectronics

TDA9109/SN by STMicroelectronics is a Vertical Deflection IC for monitors. It operates at 5-12V with 32 terminals in an IN-LINE, SHRINK PITCH package style. With BICMOS technology, it has a temp range of 0-70 °C and dimensions of 27.94mm x 10.16mm x 5.08mm for commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

R&J Components

USA . 15,967 parts In-Stock

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Vyrian

USA . 4,475 parts In-Stock

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Anansix

USA . 2,362 parts In-Stock

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Digiode

USA . 1,867 parts In-Stock

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A&K Electronics

USA . 626 parts In-Stock

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Rotakorn

Sweden . 626 parts In-Stock

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Bristol Electronics

USA . 626 parts In-Stock

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Odyssey Electronics LTD

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LittleDiode

UK . 11 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

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ECAB

Sweden . 1 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 236 parts In-Stock

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$0.517

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$0.465

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MKK Technologies

India . 1,352 parts In-Stock

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$0.972

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DigiPath Technology Company

USA . 1,352 parts In-Stock

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Corphita

USA . 4,709 parts In-Stock

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Parana Technologies

USA . 1,305 parts In-Stock

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Perfect Parts

USA . 844 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 377 parts In-Stock

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Assy Fe

Spain . 13 parts In-Stock

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Overview

Experience crystal-clear images and seamless performance with the TDA9109/SN Vertical Deflection IC by STMicroelectronics. As a leader in semiconductor manufacturing, STMicroelectronics delivers top-notch quality and reliability. Ideal for monitor applications, this IC offers unparalleled value and benefits to customers seeking high-quality vertical deflection solutions. Upgrade your display devices with the TDA9109/SN and enjoy superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in reducing the overall weight of the product, making it suitable for portable applications.

Power Supplies (V): 5,12

Support for both 5V and 12V power supplies offers versatility in operating the product in different setups or configurations.

Application: MONITOR

Specifically designed for monitor applications, ensuring optimal performance and compatibility in display devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows the product to function reliably even in challenging thermal conditions.

Technology: BICMOS

Utilization of BiCMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Vertical Deflection ICs TDA9109/SN attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 10.8V TO 13.2V SUPPLY

Application:

MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e0

Length:

27.94 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5,12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TDA9109/SN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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