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TDA8185

STMicroelectronics

TDA8185 by STMicroelectronics

TDA8185 by STMicroelectronics is a 24-terminal HORIZ/VERT DEFLECTION IC with 5V power supply. It features BIPOLAR technology, PLASTIC/EPOXY package body, and RECTANGULAR shape. Ideal for vertical deflection applications in electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,853 parts In-Stock

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4,853

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Anansix

USA . 2,112 parts In-Stock

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2,112

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Vyrian

USA . 1,424 parts In-Stock

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1,424

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LittleDiode

UK . 45 parts In-Stock

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45

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ECAB

Sweden . 36 parts In-Stock

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36

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ACDS - Activité Composants Distribution Service

France . 12 parts In-Stock

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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Huijzer Components

Netherlands . 9 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 3 parts In-Stock

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Goldney Electronics S.L.

Spain . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,036 parts In-Stock

1+ parts

$3.339

100+ parts

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$3.005

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1,036

$3.339

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$3.005

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MKK Technologies

India . 844 parts In-Stock

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$6.278

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844

$6.278

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DigiPath Technology Company

USA . 844 parts In-Stock

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$6.278

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844

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 1,933 parts In-Stock

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Parana Technologies

USA . 1,740 parts In-Stock

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$3.992

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Assy Fe

Spain . 157 parts In-Stock

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RC Electronics

USA . 117 parts In-Stock

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Perfect Parts

USA . 27 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 12 parts In-Stock

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Overview

Unlock the power of vertical deflection with the TDA8185 by STMicroelectronics. This high-quality IC offers unparalleled performance and reliability, backed by a trusted manufacturer. Ideal for a wide range of applications in the vertical deflection category, this product provides customers with unmatched value and benefits. Upgrade your electronics with the TDA8185 and experience superior quality and functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good insulation and durability, making the product resistant to environmental factors and mechanical stress.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient space utilization and easier integration into circuit designs.

General IC Type: HORIZ/VERT DEFLECTION IC

Specifically designed for horizontal and vertical deflection applications, ensuring optimal performance in display devices.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with a wide range of electronic systems.

No. of Terminals: 24

Sufficient number of terminals for connecting to other components, providing versatility in circuit configurations.

Package Style (Meter): IN-LINE

In-line package style simplifies PCB layout and assembly process, enhancing overall efficiency.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish offers good solderability and conductivity, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position allows for multiple connection options, enhancing flexibility in circuit design.

Technology: BIPOLAR

Bipolar technology offers high-speed and high-current capabilities, suitable for demanding deflection applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong mechanical support and ease of soldering, improving overall reliability.

Terminal Pitch: 2.54 mm

Standard 2.54mm terminal pitch facilitates easy connections on PCBs and compatibility with common electronic components.

Technical Specifications

Vertical Deflection ICs TDA8185 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA8185 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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