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TDA8174W

STMicroelectronics

TDA8174W by STMicroelectronics

TDA8174W by STMicroelectronics is a Vertical Deflection IC with 11 terminals, operating voltage range of 10-30V. It has a temperature range of 0-70 °C and is commonly used in TV and monitor applications due to its flange mount package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,443 parts In-Stock

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3,443

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Anansix

USA . 2,840 parts In-Stock

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2,840

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Vyrian

USA . 1,285 parts In-Stock

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1,285

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First Choice Components Inc.

USA . 20 parts In-Stock

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Q Components

USA . 6 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 5 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 636 parts In-Stock

1+ parts

$0.495

100+ parts

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$0.445

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636

$0.495

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$0.445

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MKK Technologies

India . 1,040 parts In-Stock

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$0.931

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$0.931

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DigiPath Technology Company

USA . 1,040 parts In-Stock

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$0.931

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1,040

$0.931

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Parana Technologies

USA . 429 parts In-Stock

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$0.592

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429

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$0.592

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Corphita

USA . 223 parts In-Stock

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Perfect Parts

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Assy Fe

Spain . 7 parts In-Stock

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Overview

Enhance your TV and monitor viewing experience with the TDA8174W Vertical Deflection IC by STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics delivers cutting-edge technology in a convenient rectangular package. With a wide operating temperature range and commercial-grade performance, this IC ensures optimal functionality and longevity for your electronics. Upgrade your devices today with the TDA8174W and enjoy crisp, clear visuals like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for applications in televisions and monitors.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into electronic devices.

Power Supplies (V): 10/35

The wide range of power supplies (10V to 35V) ensures compatibility with various electronic systems, providing flexibility in design and implementation.

No. of Terminals: 11

Having 11 terminals allows for efficient connection and control of the vertical deflection IC within the electronic circuit.

Application: TV; MONITOR

Designed specifically for use in televisions and monitors, ensuring optimal performance and reliability in these devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even under extended usage or elevated temperature conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C allows the vertical deflection IC to function effectively in cold environments.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and ensures proper alignment and connectivity within the electronic system.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes soldering and connection of the vertical deflection IC easy and secure, enhancing overall product reliability.

Maximum Supply Voltage (Vsup): 30 V

The high maximum supply voltage of 30V allows the vertical deflection IC to handle a wide range of voltage inputs, increasing its versatility and compatibility.

Technical Specifications

Vertical Deflection ICs TDA8174W attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PSFM-T11

No. of Functions:

1

No. of Terminals:

11

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP11,.1,.1,67

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

10/35

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Trade Compliance

TDA8174W General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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