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TDA8171

STMicroelectronics

TDA8171 by STMicroelectronics

TDA8171 by STMicroelectronics is a Vertical Deflection IC with 7 terminals, operating voltage range of 10-35V. It has a temperature range of -20 to 75 °C and is used in TV and monitor applications. Package style is flange mount with terminal finish in tin lead.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,243 parts In-Stock

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Anansix

USA . 2,213 parts In-Stock

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Vyrian

USA . 1,838 parts In-Stock

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LittleDiode

UK . 31 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 19 parts In-Stock

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ECAB

Sweden . 6 parts In-Stock

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GES GmbH

Germany . 5 parts In-Stock

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Donberg Electronics Ltd

Ireland . 4 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 2 parts In-Stock

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IDEA Electronic Components Group

UK . 222 parts In-Stock

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$2.344

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$2.110

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MKK Technologies

India . 1,225 parts In-Stock

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$4.408

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$4.408

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DigiPath Technology Company

USA . 1,225 parts In-Stock

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$4.408

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Corphita

USA . 3,947 parts In-Stock

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Parana Technologies

USA . 771 parts In-Stock

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Assy Fe

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Overview

Unleash the power of your TV or monitor with the TDA8171 Vertical Deflection IC by STMicroelectronics. This high-quality product offers reliable performance and durability, backed by STMicroelectronics' reputation for excellence. Perfect for a range of applications, this IC delivers exceptional value with its impressive power supplies, temperature range, and terminal design. Elevate your viewing experience with the TDA8171 and enjoy superior quality and reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring reliability and affordability.

Package Shape: RECTANGULAR

Compact shape allows for efficient use of space on circuit boards.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection applications in TVs and monitors, ensuring optimal performance.

Power Supplies (V): 10/35

Supports a wide range of power supply voltages, making it versatile and compatible with various systems.

No. of Terminals: 7

Sufficient number of terminals for connecting to external components and interfaces.

Package Style (Meter): FLANGE MOUNT

Allows for secure mounting and connection in electronic devices.

Application: TV; MONITOR

Specifically designed for use in TVs and monitors, ensuring compatibility and optimized performance in these devices.

Maximum Operating Temperature: 75 °C

Can operate effectively at relatively high temperatures, ensuring durability and reliability under varying conditions.

Minimum Operating Temperature: -20 °C

Can operate effectively at low temperatures, making it suitable for a range of environments.

Terminal Finish: TIN LEAD

Provides a reliable terminal finish for stable connections with other components.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning allows for efficient routing and connection of wires.

Minimum Supply Voltage (Vsup): 10 V

Can operate at relatively low supply voltages, making it energy-efficient.

Temperature Grade: COMMERCIAL EXTENDED

Designed for commercial use with extended temperature range, ensuring performance in various environments.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections to the circuit board.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for efficient PCB layout and connection.

Maximum Supply Voltage (Vsup): 35 V

Supports higher supply voltages for compatibility with a wide range of systems and applications.

Technical Specifications

Vertical Deflection ICs TDA8171 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

10/35

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA8171 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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