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TEA2037AD

STMicroelectronics

TEA2037AD by STMicroelectronics

TEA2037AD by STMicroelectronics is a Vertical Deflection IC with 16 terminals, operating at 9V. It features a small outline package and can withstand temperatures up to 150 °C. Ideal for horizontal/vertical deflection applications in electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,660 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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4,660

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-

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Digiode

USA . 3,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,567

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Anansix

USA . 261 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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261

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,201 parts In-Stock

1+ parts

$1.450

100+ parts

-

1k+ parts

$1.305

10k+ parts

-

2,201

$1.450

-

$1.305

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MKK Technologies

India . 1,156 parts In-Stock

1+ parts

$2.726

100+ parts

-

1k+ parts

-

10k+ parts

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1,156

$2.726

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-

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DigiPath Technology Company

USA . 1,156 parts In-Stock

1+ parts

$2.726

100+ parts

-

1k+ parts

-

10k+ parts

-

1,156

$2.726

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-

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Corphita

USA . 3,183 parts In-Stock

1+ parts

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3,183

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Parana Technologies

USA . 664 parts In-Stock

1+ parts

-

100+ parts

$1.734

1k+ parts

-

10k+ parts

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664

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$1.734

-

-

Overview

Experience superior performance and reliability with the TEA2037AD Vertical Deflection IC from STMicroelectronics. Known for their high-quality components and innovative technology, STMicroelectronics delivers cutting-edge solutions for a wide range of applications. The TEA2037AD offers customers exceptional value with its efficient power supplies, compact package style, and dual terminal position. Trust in STMicroelectronics to provide you with the best vertical deflection IC on the market, ensuring seamless integration and optimal performance for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the product is lightweight and cost-effective.

Surface Mount: YES

Easy to install and suitable for modern surface mount technology.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into electronic circuit designs.

General IC Type: HORIZ/VERT DEFLECTION IC

Specifically designed for horizontal and vertical deflection applications, ensuring compatibility and optimal performance.

Power Supplies (V): 9

Operates on a standard 9V power supply, making it easy to use with common power sources.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards and reduces overall size of the product.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for various applications.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and connectivity.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and layout.

Technology: BIPOLAR

Bipolar technology offers reliable and stable performance for vertical deflection applications.

Terminal Form: GULL WING

Gull wing terminal form provides a strong mechanical connection and ease of soldering.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy connection to other components and circuits.

Technical Specifications

Vertical Deflection ICs TEA2037AD attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TEA2037AD General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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