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TDA1180P

STMicroelectronics

TDA1180P by STMicroelectronics

TDA1180P by STMicroelectronics is a bipolar horizontal deflection IC designed for monitors. It operates with power supplies of 5V and -12/-15V, featuring 16 terminals in a rectangular plastic package. Key specs include a max supply voltage of 13.2V and a blanking output.

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Jameco Electronics

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Vectronix, Inc

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Component Electronics Inc.

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Sinequanon

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Fibra_Brandt Electronic GMBH

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Huijzer Components

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Carlin Systems, Inc.

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ABC Electronics Ltd.

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Mil-Aero Solutions, Inc.

USA . 35 parts In-Stock

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Cogito LLC

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MISTER SPROCKETS

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Resion

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MRC Electronics

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ECAB

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LittleDiode

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GES GmbH

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ComSIT Distribution GmbH

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Sogenti Electronics

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Digital Electronic Gebert Verwaltungs UG

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IDEA Electronic Components Group

UK . 299 parts In-Stock

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MKK Technologies

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DigiPath Technology Company

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A-Z Elektronik GmbH

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Parana Technologies

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Corphita

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Cyclops Electronics Ltd (Excess)

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Overview

Elevate your display performance with the TDA1180P from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This robust Vertical Deflection IC ensures exceptional quality and reliability in monitor applications, delivering precise control for vibrant visuals. Its user-friendly design and efficient power management offer seamless integration into your systems, enhancing functionality while reducing energy costs. Choose TDA1180P for unparalleled value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to thermal cycling, making it suitable for various environmental conditions.

Package Shape: RECTANGULAR

A rectangular shape allows for efficient space utilization on PCBs, facilitating compact designs in monitor applications.

General IC Type: HORIZONTAL DEFLECTION IC

Specialized for horizontal deflection tasks, this IC is optimized for use in monitor displays, ensuring precise control.

Power Supplies: 5,-12/-15 V

Compatibility with multiple power supply voltages increases versatility in system designs, accommodating various configurations.

No. of Terminals: 16

Having 16 terminals allows for a wide range of functions and connections, enhancing the IC's capabilities in complex circuits.

Package Style (Meter): IN-LINE

In-line package style simplifies integration into existing designs, streamlining manufacturing and assembly processes.

Application: MONITOR

Specifically designed for monitor applications, this IC provides optimal performance tailored to display technology requirements.

Blanking Output: YES

The presence of a blanking output feature improves display quality by reducing unwanted noise and enhancing visual clarity.

Terminal Finish: MATTE TIN

Matte tin finish helps in preventing oxidation, ensuring reliable soldering and longevity of the connections.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout design, accommodating a variety of configurations for ease of installation.

Maximum Seated Height: 5.1 mm

A low maximum seated height allows for a compact footprint on PCB, aiding in space-saving designs.

Width: 7.62 mm

A width of 7.62 mm is standard for many PCB applications, making it easily integrable into existing systems.

Minimum Supply Voltage: 9.5 V

Operational at a minimum supply voltage of 9.5 V ensures compatibility with a wide range of power supplies.

Technology: BIPOLAR

Bipolar technology provides fast switching speeds and low power consumption, crucial for efficient horizontal deflection operations.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical strength and reliability in connections, which is critical for high-vibration environments.

Terminal Pitch: 2.54 mm

A 2.54 mm terminal pitch is common in designs, facilitating ease of soldering and ensuring compatibility with various PCB layouts.

Maximum Supply Voltage: 13.2 V

Support for a maximum supply voltage of 13.2 V allows for robust applications, ensuring the IC can handle higher power demands.

Technical Specifications

Vertical Deflection ICs TDA1180P attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

MONITOR

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,-12/-15

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

9.5 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA1180P General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-12-318-6544, 5962123186544

NIIN

123186544

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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