Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TDA1180P by STMicroelectronics is a bipolar horizontal deflection IC designed for monitors. It operates with power supplies of 5V and -12/-15V, featuring 16 terminals in a rectangular plastic package. Key specs include a max supply voltage of 13.2V and a blanking output.
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Fibra_Brandt Electronic GMBH
Huijzer Components
Carlin Systems, Inc.
ABC Electronics Ltd.
Mil-Aero Solutions, Inc.
Cogito LLC
MISTER SPROCKETS
Resion
MRC Electronics
ECAB
LittleDiode
GES GmbH
ComSIT Distribution GmbH
Sogenti Electronics
Digital Electronic Gebert Verwaltungs UG
Electronics Depot
IDEA Electronic Components Group
$2.641
$2.377
MKK Technologies
$4.967
DigiPath Technology Company
A-Z Elektronik GmbH
Parana Technologies
$3.158
Assy Fe
Corphita
Kepictronics
Perfect Parts
Cyclops Electronics Ltd (Excess)
The use of plastic/epoxy ensures durability and resistance to thermal cycling, making it suitable for various environmental conditions.
A rectangular shape allows for efficient space utilization on PCBs, facilitating compact designs in monitor applications.
Specialized for horizontal deflection tasks, this IC is optimized for use in monitor displays, ensuring precise control.
Compatibility with multiple power supply voltages increases versatility in system designs, accommodating various configurations.
Having 16 terminals allows for a wide range of functions and connections, enhancing the IC's capabilities in complex circuits.
In-line package style simplifies integration into existing designs, streamlining manufacturing and assembly processes.
Specifically designed for monitor applications, this IC provides optimal performance tailored to display technology requirements.
The presence of a blanking output feature improves display quality by reducing unwanted noise and enhancing visual clarity.
Matte tin finish helps in preventing oxidation, ensuring reliable soldering and longevity of the connections.
Dual terminal positions provide flexibility in PCB layout design, accommodating a variety of configurations for ease of installation.
A low maximum seated height allows for a compact footprint on PCB, aiding in space-saving designs.
A width of 7.62 mm is standard for many PCB applications, making it easily integrable into existing systems.
Operational at a minimum supply voltage of 9.5 V ensures compatibility with a wide range of power supplies.
Bipolar technology provides fast switching speeds and low power consumption, crucial for efficient horizontal deflection operations.
Through-hole terminal form enhances mechanical strength and reliability in connections, which is critical for high-vibration environments.
A 2.54 mm terminal pitch is common in designs, facilitating ease of soldering and ensuring compatibility with various PCB layouts.
Support for a maximum supply voltage of 13.2 V allows for robust applications, ensuring the IC can handle higher power demands.
Vertical Deflection ICs TDA1180P attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics
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TDA1180P General Purpose ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NSN
5962-12-318-6544, 5962123186544
NIIN
123186544
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
SS14
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
2N7002
Plessey Semiconductors Discrete Components Div
Other Transistors;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
SMBJ18CA
Db Lectro
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology
NE555DR
Texas Instruments
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
MICRODIODE ELECTRONICS SHENZHEN CO LTD
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
LFXTAL025159REEL
Iqd Frequency Products
LFXTAL025159REEL by IQD Frequency Products is a 32.768 kHz crystal oscillator with 20 ppm frequency tolerance and 40,000 ohm series resistance. It is ideal for applications requiring precise timekeeping, such as real-time clocks in IoT devices or microcontrollers in wearables. The surface-mount design with a drive level of 1 uW makes it suitable for compact electronic systems.
Semitronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
STV9303W
STMicroelectronics
STV9303W by STMicroelectronics is a vertical deflection IC designed for TV applications. It operates at a max supply voltage of 35V, features 11 terminals in a zig-zag position, and comes in a rectangular plastic/epoxy package. Ideal for enhancing display performance.
TDA4863J
NXP Semiconductors
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR;
NTE1664
Nte Electronics
NTE1664 by Nte Electronics is a Vertical Deflection IC with 22 terminals in RECTANGULAR PLASTIC/EPOXY package. It operates b/w -20°C to 75°C, suitable for TV applications. Features include Blanking Output and a supply voltage range of 12V.
TDA3653B/N2,112
VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 10 V;
LA78041
LA78041 by Onsemi is a Vertical Deflection IC with 7 terminals and a power supply range of 16V to 33V. It operates b/w -20 °C to 85°C, making it suitable for TV applications due to its RECTANGULAR package style and ZIG-ZAG terminal position.
TDA8351A
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 13; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA8350Q
TA1317AFG
Toshiba
HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 30; Package Code: SSOP; Package Shape: RECTANGULAR;
TDA4853/V1
HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 32; Package Code: SDIP; Package Shape: RECTANGULAR;
KA2138
Samsung
HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
TDA9102F
TDA9102F by STMicroelectronics is a versatile horizontal/vertical deflection IC designed for monitors. It operates at 12V, features a 20-terminal dual configuration, and utilizes bipolar technology. Its rectangular plastic/epoxy package ensures reliable performance in display applications.
TDA8185
TDA8185 by STMicroelectronics is a 24-terminal HORIZ/VERT DEFLECTION IC with 5V power supply. It features BIPOLAR technology, PLASTIC/EPOXY package body, and RECTANGULAR shape. Ideal for vertical deflection applications in electronic devices.
935264151112
TDA8174W
TDA8174W by STMicroelectronics is a Vertical Deflection IC with 11 terminals, operating voltage range of 10-30V. It has a temperature range of 0-70 °C and is commonly used in TV and monitor applications due to its flange mount package style.
TDA4866
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: SIP; Package Shape: RECTANGULAR;
TDA3653CQ/N2
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: ZIP; Package Shape: RECTANGULAR; Terminal Position: ZIG-ZAG;
TDA1170SH
TDA1170SH by STMicroelectronics is a Vertical Deflection IC with 25V power supply, 16 terminals in IN-LINE package style. It utilizes BIPOLAR technology and Tin/Lead terminal finish. Ideal for vertical deflection applications in electronic devices.
STV9379F
STV9379F by STMicroelectronics is a VERTICAL DEFLECTION IC with 7 terminals, operating voltage range of 10-42V. It has a temperature range of -20 to 75 °C and is used in TV and monitor applications. The package style is FLANGE MOUNT with PLASTIC/EPOXY body material.
TDA4852N
KA2131
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Package Style (Meter): FLANGE MOUNT;
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TDA1771
VERTICAL DEFLECTION IC; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 10; Package Shape: RECTANGULAR; Surface Mount: NO;
TDA1170D
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Blanking Output: NO;
TDA1170N
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PQIP-T12;
TDA1170S
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: RECTANGULAR; Blanking Output: NO;
VERTICAL DEFLECTION IC; Terminal Form: PIN/PEG; No. of Terminals: 16; Package Code: QIP; Package Shape: RECTANGULAR; Surface Mount: NO;
TDA1175
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: RECTANGULAR; Package Equivalence Code: QI16B,.2/.4,100TB;
TDA1175P
VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TDA1670A
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 15; Package Code: ZIP; Package Shape: RECTANGULAR; Package Equivalence Code: ZIP15,.2,.17TB;
TDA1675A
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 15; Package Code: ZIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
TDA1770A
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
TDA1872A
VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 15; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA1082
EAST-WEST CORRECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
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