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TDA1175P

STMicroelectronics

TDA1175P by STMicroelectronics

TDA1175P by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates b/w 10V and 35V, features a dual terminal configuration with a max temp of 85 °C, and comes in a rectangular plastic package. Ideal for reliable performance in display applications.

Median Price

$6.720

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 7 parts In-Stock

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$6.720

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Vyrian

USA . 4,209 parts In-Stock

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Anansix

USA . 2,528 parts In-Stock

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LWI Electronics Inc

India . 2,391 parts In-Stock

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Digiode

USA . 1,785 parts In-Stock

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Prism Electronics

USA . 148 parts In-Stock

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Quantum Digital Technology

USA . 75 parts In-Stock

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ECAB

Sweden . 51 parts In-Stock

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Cyclops Electronics Ltd

UK . 45 parts In-Stock

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Extreme Components

USA . 43 parts In-Stock

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MRC Electronics

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MISTER SPROCKETS

USA . 37 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

. 24 parts In-Stock

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Huijzer Components

Netherlands . 12 parts In-Stock

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Donberg Electronics Ltd

Ireland . 10 parts In-Stock

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10

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Manoshevitz Elec. Sales

Israel . 10 parts In-Stock

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10

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Odyssey Electronics LTD

USA . 10 parts In-Stock

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10

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Microfarads

USA . 7 parts In-Stock

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First Choice Components Inc.

USA . 7 parts In-Stock

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LittleDiode

UK . 6 parts In-Stock

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GES GmbH

Germany . 6 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 5 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 3 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 766 parts In-Stock

1+ parts

$1.297

100+ parts

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$1.167

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766

$1.297

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$1.167

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MKK Technologies

India . 1,439 parts In-Stock

1+ parts

$2.439

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1,439

$2.439

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DigiPath Technology Company

USA . 1,439 parts In-Stock

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$2.439

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1,439

$2.439

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AZTECH Wire

Italy . 102 parts In-Stock

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$15.400

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$15.400

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,492 parts In-Stock

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Metaverse IC Inc.

Canada . 4,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,622 parts In-Stock

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Parana Technologies

USA . 2,271 parts In-Stock

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$1.551

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$1.551

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Corphita

USA . 1,325 parts In-Stock

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Assy Fe

Spain . 1,036 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,003 parts In-Stock

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Futuretech Components

Singapore . 524 parts In-Stock

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524

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Perfect Parts

USA . 336 parts In-Stock

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336

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Cyclops Electronics Ltd (Excess)

UK . 155 parts In-Stock

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Overview

Elevate your display technology with the TDA1175P from STMicroelectronics, a trusted leader in innovation and quality. Designed for optimal performance in TVs and monitors, this vertical deflection IC ensures superior image stability and clarity. With its robust temperature tolerance and reliable power supply range, customers benefit from enhanced durability and efficiency. Trust STMicroelectronics to deliver exceptional value that transforms your viewing experience!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and a lightweight design, providing good thermal and electrical insulation.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space management on circuit boards, making it easier to integrate into various designs.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection applications, this IC is optimized for performance in TVs and monitors, ensuring reliable functionality.

Power Supplies (V): 10/35

Wide voltage range (10V to 35V) provides flexibility in design and compatibility with various power supply configurations.

No. of Terminals: 16

With 16 terminals, this IC offers ample connectivity options, allowing for a variety of circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style is compatible with standard circuit board layouts, facilitating easier assembly and maintenance.

Application: TV; MONITOR

Designed specifically for use in TVs and monitors, it ensures excellent performance in vertical deflection functions, enhancing display quality.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, it ensures reliable operation in warm environments, reducing the risk of overheating.

Minimum Operating Temperature: -25 °C

A minimum temperature rating of -25 °C allows the IC to function effectively in a range of environments, making it suitable for diverse applications.

Terminal Finish: TIN

The tin terminal finish enhances solderability and provides good corrosion resistance, ensuring durable and reliable connections.

Terminal Position: DUAL

Dual terminal positioning offers design flexibility, allowing for more compact board layouts and easier routing.

Maximum Seated Height: 5.1 mm

A maximum seated height of 5.1 mm helps in maintaining a low profile on the PCB, contributing to space efficiency.

Width: 7.62 mm

The 7.62 mm width optimizes board space and is conducive to high-density circuit designs without compromising performance.

Minimum Supply Voltage (Vsup): 10 V

A minimum supply voltage of 10V ensures reliable operation in various power configurations, enhancing overall system stability.

Technology: BIPOLAR

The bipolar technology used in this IC allows for faster switching and lower power consumption, ideal for high-quality video applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical connections, enhancing durability and reliability in physical assembly.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard in many designs, making it easy to integrate this component into existing circuit layouts.

Maximum Supply Voltage (Vsup): 35 V

The maximum supply voltage of 35V allows for high-voltage applications, which is crucial for driving various display technologies effectively.

Technical Specifications

Vertical Deflection ICs TDA1175P attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

General IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

10/35

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA1175P General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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