Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TDA1170S by STMicroelectronics is a Vertical Deflection IC with 12 terminals, operating voltage range of 10-35V. It comes in PLASTIC/EPOXY package style suitable for TV applications. Technology used is BIPOLAR with TIN LEAD finish and RECTANGULAR shape.
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Vyrian
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Bristol Electronics
Electronics Depot
ECAB
ComSIT Distribution GmbH
R&J Components
Resion
Pegasus Components GmbH
LIBRA Elektronik GmbH
Freddi Giovanni
GES GmbH
LWI Electronics Inc
Manotoh
Corel Iberica Componentes, S.L.
Fibra_Brandt Electronic GMBH
Mentor Electronics Marketing, LLC
Electronic Expediters
Specialty Parts & Electronic Components, Inc. (S.P.E.C.)
PC Components Company LLC
LittleDiode
Sogenti Electronics
Sinequanon
Standard Data Resources
Digital Electronic Gebert Verwaltungs UG
Huijzer Components
Goldney Electronics S.L.
Prism Electronics
Halfin
IDEA Electronic Components Group
$0.871
$0.784
MKK Technologies
$1.638
DigiPath Technology Company
Kepictronics
Corphita
Parana Technologies
$1.042
Perfect Parts
Cyclops Electronics Ltd (Excess)
Assy Fe
Schahn Electronic Components
Durable and lightweight material provides protection for the internal components of the IC, ensuring a longer lifespan.
Rectangular shape allows for easy integration into various electronic devices and circuit layouts.
Specifically designed for vertical deflection applications in TVs, ensuring optimal performance in this specific function.
Provides sufficient power for the IC to function effectively in vertical deflection tasks, delivering reliable performance.
A higher number of terminals allow for more connectivity options and versatile implementation in TV circuits.
Tin lead finish ensures good solderability and electrical conductivity, facilitating easier installation and maintenance.
Low minimum supply voltage allows for operation in a wider range of power supply setups, increasing compatibility.
Bipolar technology offers reliability and stability in vertical deflection tasks, ensuring consistent performance over time.
Through-hole terminals provide a strong and secure connection with the circuit board, reducing the risk of disconnection.
High maximum supply voltage allows for enhanced flexibility in power supply configurations, improving overall reliability.
Vertical Deflection ICs TDA1170S attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics
Application:
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TDA1170S General Purpose ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NSN
5962-01-248-7300, 5962012487300, 5962-12-323-1386, 5962123231386, 5962-15-135-0303, 5962151350303, 5962-25-134-7280, 5962251347280
NIIN
012487300, 123231386, 151350303, 251347280
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Synsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
DP83848IVVX/NOPB
Texas Instruments
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
Space Power Electronics
1N4148WT
Onsemi
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
2N7002,215
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
BSS138PS,115
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
SMMBT3904LT1G
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Meritek Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Tak Cheong Electronics Holdings
TDA9112
TDA9112 by STMicroelectronics is a BICMOS horiz/vert deflection IC designed for monitors, operating b/w 10.8V and 13.2V. It features a max temp of 70 °C, 32 terminals in a dual position, and offers blanking output. Its compact size (27.94mm x 10.16mm) ensures efficient integration.
TDA2593
HORIZONTAL DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
KA2136
Samsung
VERTICAL DEFLECTION IC; Terminal Form: PIN/PEG; No. of Terminals: 16; Package Code: QIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PQIP-P16;
TDA9113
TDA9113 by STMicroelectronics is a versatile horiz/vert deflection IC designed for monitors, operating b/w 10.8V and 13.2V. It features a dual terminal configuration with 32 pins and supports temperatures from 0 °C to 70°C. Its compact size (27.94mm x 10.16mm) ensures efficient integration in various applications.
TDA3653CU
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: SIP; Package Shape: RECTANGULAR; Terminal Position: SINGLE;
935240230112
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 13; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA8359J
VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA8433
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
KA2130AS
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL; No. of Terminals: 10; Qualification: Not Qualified; Surface Mount: NO; Package Equivalence Code: SIP10,.07TB;
TA7609P
Toshiba
HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TDA2658
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 13; Package Shape: RECTANGULAR; JESD-30 Code: R-PSFM-T13; Minimum Supply Voltage (Vsup): 9 V;
TDA4860
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; JESD-30 Code: R-PSFM-T9;
STV9325
STV9325 by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates with a supply voltage range of 10-35 V, features 7 terminals in a flange mount package, and utilizes bipolar technology. Ideal for enhancing display performance in consumer electronics.
TDA8215B
TDA8215B by STMicroelectronics is a versatile Horiz/Vert Deflection IC designed for TV applications. It operates b/w 9-10.5V, features a max temp of 70 °C, and includes a blanking output. Its compact 20-terminal design ensures efficient performance in consumer electronics.
TDA2270
TDA2270 by STMicroelectronics is a Vertical Deflection IC with 16 terminals, operating voltage of 35V, and temperature range from -40 to 150 °C. It is used in TV and monitor applications, featuring a rectangular package style made of plastic/epoxy material.
STV9302A
STV9302A by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates with a power supply range of 10-35 V, features 7 terminals in a flange mount package, and utilizes bipolar technology. Its compact design ensures efficient performance in display applications.
LM1291N
LM1291N by Texas Instruments is a HORIZONTAL DEFLECTION IC with 28 terminals in an IN-LINE package. It operates b/w -20 to 80 °C and requires a supply voltage of 10.8-13.2 V, drawing a max current of 40 mA. Ideal for MONITOR applications due to its BIPOLAR technology and TIN LEAD finish.
TDA4861U
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: SIP; Package Shape: RECTANGULAR;
TDA8359J/N2,112
TEA2037AD
TEA2037AD by STMicroelectronics is a Vertical Deflection IC with 16 terminals, operating at 9V. It features a small outline package and can withstand temperatures up to 150 °C. Ideal for horizontal/vertical deflection applications in electronics.
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TDA1771
VERTICAL DEFLECTION IC; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 10; Package Shape: RECTANGULAR; Surface Mount: NO;
TDA1170D
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Blanking Output: NO;
TDA1170N
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PQIP-T12;
TDA1170SH
VERTICAL DEFLECTION IC; Terminal Form: PIN/PEG; No. of Terminals: 16; Package Code: QIP; Package Shape: RECTANGULAR; Surface Mount: NO;
TDA1175
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: RECTANGULAR; Package Equivalence Code: QI16B,.2/.4,100TB;
TDA1175P
VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TDA1180P
HORIZONTAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
TDA1670A
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 15; Package Code: ZIP; Package Shape: RECTANGULAR; Package Equivalence Code: ZIP15,.2,.17TB;
TDA1675A
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 15; Package Code: ZIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
TDA1770A
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
TDA1872A
VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 15; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA1082
EAST-WEST CORRECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TDA1170
Sprague Electric
VERTICAL DEFLECTION IC; Terminal Form: PIN/PEG; No. of Terminals: 16; Package Code: QIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TDA1170QM
Fairchild Semiconductor
VERTICAL DEFLECTION IC; Terminal Form: PIN/PEG; No. of Terminals: 16; Package Code: QIP; Package Shape: RECTANGULAR; Technology: BIPOLAR;
VERTICAL DEFLECTION IC; Terminal Form: PIN/PEG; No. of Terminals: 16; Package Code: QIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE;
Supply Digital Components
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