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STV6888

STMicroelectronics

STV6888 by STMicroelectronics

STV6888 by STMicroelectronics is a versatile Horiz/Vert Deflection IC designed for monitors, operating b/w 10.8V and 13.2V. It features a compact 32-terminal package with a max temp of 70 °C and uses BICMOS technology for efficient performance. Ideal for reliable display control in commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,265 parts In-Stock

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4,265

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Anansix

USA . 2,697 parts In-Stock

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2,697

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Digiode

USA . 837 parts In-Stock

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837

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Cyclops Electronics Ltd

UK . 74 parts In-Stock

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Electronics Depot

USA . 30 parts In-Stock

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30

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ABC Electronics Ltd.

UK . 20 parts In-Stock

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20

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IDEA Electronic Components Group

UK . 1,782 parts In-Stock

1+ parts

$0.563

100+ parts

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$0.507

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1,782

$0.563

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$0.507

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MKK Technologies

India . 334 parts In-Stock

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$1.059

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334

$1.059

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DigiPath Technology Company

USA . 334 parts In-Stock

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$1.059

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334

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Assy Fe

Spain . 5,946 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,818 parts In-Stock

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4,818

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Corphita

USA . 1,541 parts In-Stock

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Kepictronics

USA . 1,200 parts In-Stock

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Parana Technologies

USA . 1,158 parts In-Stock

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$0.673

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1,158

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$0.673

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Overview

Experience unparalleled performance with the STV6888 from STMicroelectronics, a leader in innovation and quality. Engineered for vertical deflection applications in monitors, this robust IC ensures precise image rendering and reliability under various environmental conditions. Its compact design makes it perfect for space-saving solutions, while its durable construction guarantees longevity. Elevate your projects with the STV6888, where exceptional value meets cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient space utilization on PCBs, facilitating better layouts and compact designs.

General IC Type: HORIZ/VERT DEFLECTION IC

This specific IC type is optimized for horizontal and vertical deflection control in monitor applications, ensuring precise display performance.

Power Supplies (V): 12

Operating at a standard 12V makes this IC compatible with common power supply configurations, simplifying integration into existing systems.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options, allowing for complex functionality and flexibility in circuit design.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch style promotes a compact size, which is great for modern electronics where space is a premium.

Application: MONITOR

Designed specifically for monitor applications, this IC enhances display quality and reliability, making it an ideal choice for display manufacturers.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in various environments, making it suitable for consumer electronics.

Blanking Output: YES

The inclusion of a blanking output feature enables better control over display timing, thus improving visual quality during operation.

Minimum Operating Temperature: 0 °C

This IC can function in low-temperature environments starting from 0 °C, broadening its application range in various climates.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and durability, ensuring robust connections and long-term reliability in the circuit.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options, facilitating integration into various board designs.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm keeps a low profile, making it easier to fit in compact electronic designs.

Width: 10.16 mm

A width of 10.16 mm contributes to compact PCB design, helping engineers design smaller and more efficient layouts.

Minimum Supply Voltage (Vsup): 10.8 V

The minimum supply voltage of 10.8 V allows for operation in a range of typical power supply scenarios, increasing compatibility.

Length: 27.94 mm

Length of 27.94 mm strikes a balance between compact size and adequate terminal spacing, allowing for easier handling and soldering.

Temperature Grade: COMMERCIAL

Commercial temperature grade suggests reliability for consumer applications, ensuring stable performance under typical operational conditions.

Technology: BICMOS

Utilizing BICMOS technology provides the advantages of both bipolar and CMOS performance, resulting in low power consumption and high-speed operation.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance mechanical stability and ease of assembly, making this IC suitable for robust applications.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm provides a good balance for soldering and circuit design, making it practical for a wide range of applications.

Maximum Supply Voltage (Vsup): 13.2 V

Operating with a maximum supply voltage of 13.2 V ensures flexibility and headroom for transient conditions without performance compromise.

Technical Specifications

Vertical Deflection ICs STV6888 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

MONITOR

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e0

Length:

27.94 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

STV6888 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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