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STV6889

STMicroelectronics

STV6889 by STMicroelectronics

STV6889 by STMicroelectronics is a versatile Horiz/Vert Deflection IC designed for monitors, operating b/w 10.8V and 13.2V. It features a compact 32-terminal package with a max temp of 70 °C and uses BICMOS technology for efficient performance. Ideal for enhancing display quality in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,523 parts In-Stock

1+ parts

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3,523

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Vyrian

USA . 2,594 parts In-Stock

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2,594

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Anansix

USA . 2,165 parts In-Stock

1+ parts

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2,165

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,989 parts In-Stock

1+ parts

$2.777

100+ parts

-

1k+ parts

$2.500

10k+ parts

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1,989

$2.777

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$2.500

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MKK Technologies

India . 1,696 parts In-Stock

1+ parts

$5.223

100+ parts

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1,696

$5.223

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DigiPath Technology Company

USA . 1,696 parts In-Stock

1+ parts

$5.223

100+ parts

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10k+ parts

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1,696

$5.223

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A-Z Elektronik GmbH

Germany . 6,929 parts In-Stock

1+ parts

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6,929

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Corphita

USA . 4,546 parts In-Stock

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4,546

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Kepictronics

USA . 1,920 parts In-Stock

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1,920

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Parana Technologies

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$3.321

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20

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$3.321

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ChipstoGo Electronic ltd

UK . 13 parts In-Stock

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13

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Overview

Elevate your display technology with the STV6889 from STMicroelectronics, a leader in innovative semiconductor solutions. This advanced Vertical Deflection IC ensures exceptional performance for monitors, delivering unparalleled image quality and reliability. Crafted with precision in durable plastic/epoxy packaging, it thrives in various environments, making it ideal for commercial applications. Experience enhanced efficiency, reduced power consumption, and robust operation that empower your devices to shine.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against moisture, making the IC suitable for various environmental conditions.

Package Shape: RECTANGULAR

A rectangular package shape allows for more efficient space utilization on PCBs, enabling compact designs in monitor applications.

General IC Type: HORIZ/VERT DEFLECTION IC

Designed specifically for horizontal and vertical deflection, this IC is optimized for monitor applications, providing precise control and high performance.

Power Supplies (V): 12

Operating at a standard power supply of 12V ensures compatibility with most existing systems and simplifies implementation.

No. of Terminals: 32

With 32 terminals, this IC provides ample connectivity options for various functions, enhancing design flexibility.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style allows for easy integration into space-constrained designs, optimizing board layout.

Application: MONITOR

Specifically designed for monitor applications, this IC ensures optimized performance and reliability in visual display technologies.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows for reliable performance in warmer environments, making it suitable for various conditions.

Blanking Output: YES

The inclusion of a blanking output feature enhances the IC's capabilities for efficient video signal processing, improving overall image quality.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, the IC can function in a variety of climates, ensuring versatility in application.

Terminal Position: DUAL

Dual terminal positions provide flexibility in layout design and ease of installation, making assembly more efficient.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm allows for low-profile designs, providing more clearance for other components on the PCB.

Width: 10.16 mm

The width of 10.16 mm is suitable for compact designs, making it easier to fit in tight spaces without sacrificing functionality.

Minimum Supply Voltage (Vsup): 10.8 V

With a low minimum supply voltage, this IC can be powered by various voltage sources, enhancing its adaptability.

Length: 27.94 mm

The moderate length of 27.94 mm allows for a balance between connectivity and space efficiency on the PCB.

Temperature Grade: COMMERCIAL

Being classified for commercial grade use ensures that this IC is built to meet standard industry reliability requirements.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of bipolar and CMOS, offering low power consumption along with high-speed operation.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical connections, making it ideal for applications requiring significant physical stability.

Terminal Pitch: 1.778 mm

The terminal pitch of 1.778 mm facilitates easy soldering and enhances the reliability of the electrical connections.

Maximum Supply Voltage (Vsup): 13.2 V

With a maximum supply voltage of 13.2V, this IC can handle varying power conditions, ensuring stable operation across a range of applications.

Technical Specifications

Vertical Deflection ICs STV6889 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

MONITOR

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PDIP-T32

Length:

27.94 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

STV6889 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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