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TDA9106

STMicroelectronics

TDA9106 by STMicroelectronics

TDA9106 by STMicroelectronics is a versatile HORIZ/VERT deflection IC designed for monitors, operating b/w 5V and 12V. It features a max temp of 70 °C, 42 terminals in an in-line package, and includes a blanking output. Its compact size (15.24mm x 36.83mm) ensures efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,874 parts In-Stock

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4,874

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Digiode

USA . 1,910 parts In-Stock

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1,910

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Anansix

USA . 1,689 parts In-Stock

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1,689

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Component Electronics Inc.

Canada . 28 parts In-Stock

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28

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Electronic Expediters

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,136 parts In-Stock

1+ parts

$3.341

100+ parts

-

1k+ parts

$3.006

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2,136

$3.341

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$3.006

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MKK Technologies

India . 2,046 parts In-Stock

1+ parts

$6.282

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2,046

$6.282

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DigiPath Technology Company

USA . 2,046 parts In-Stock

1+ parts

$6.282

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2,046

$6.282

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Corphita

USA . 740 parts In-Stock

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740

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Parana Technologies

USA . 48 parts In-Stock

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$3.994

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48

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$3.994

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Perfect Parts

USA . 34 parts In-Stock

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34

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Overview

Unlock superior performance with the TDA9106 from STMicroelectronics, a leader in innovative semiconductor solutions. This Vertical Deflection IC is designed for exceptional reliability and efficiency, perfect for monitors demanding high-quality visual output. With its compact size and advanced technology, it ensures seamless operation across various applications. Experience enhanced image stability and lower power consumption—choose TDA9106 for unmatched value and performance in your electronic designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers excellent insulation and reliability, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, allowing for compact designs.

General IC Type: HORIZ/VERT DEFLECTION IC

Specialized for horizontal and vertical deflection, ensuring precise control in monitor applications.

Power Supplies (V): 5, 12

Supports both 5V and 12V power supplies, providing flexibility for various system designs.

No. of Terminals: 42

With 42 terminals, it allows for numerous connections, enabling complex functionalities and connections in circuits.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line package and shrink pitch arrangement support efficient layout on PCBs, facilitating easier mounting.

Application: MONITOR

Designed specifically for monitor applications, ensuring high performance and reliability in display systems.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures stability in various environments, making it robust for commercial use.

Blanking Output: YES

Features a blanking output for enhanced video signal processing, improving screen clarity and performance.

Minimum Operating Temperature: 0 °C

Functional at a minimum temperature of 0 °C, suitable for a wide range of environmental conditions.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides excellent solderability and long-term reliability in assemblies.

Terminal Position: DUAL

Dual terminal position enhances the layout options, allowing for better design flexibility.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm contributes to low-profile designs, ideal for slim electronic devices.

Width: 15.24 mm

Compact width of 15.24 mm aids in effective space management on PCB during design.

Minimum Supply Voltage (Vsup): 5 V

Operates at a minimum supply voltage of 5V, providing compatibility with various low-power systems.

Length: 36.83 mm

The length of 36.83 mm allows for efficient PCB layout while accommodating necessary circuitry.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that it meets industry standards for performance and reliability.

Technology: BICMOS

BICMOS technology integrates the advantages of both bipolar and CMOS transistors, enhancing performance and reducing power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong mechanical support and easier handling during assembly.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm facilitates dense layouts while ensuring easy soldering and assembly.

Maximum Supply Voltage (Vsup): 5 V

A maximum supply voltage of 5V ensures compatibility with standard low voltage power systems.

Technical Specifications

Vertical Deflection ICs TDA9106 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO NEEDS 12V SUPPLY VOLTAGE

Application:

MONITOR

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PDIP-T42

JESD-609 Code:

e0

Length:

36.83 mm

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP42,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5,12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TDA9106 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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