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LA7841

Onsemi

LA7841 by Onsemi

LA7841 by Onsemi is a Vertical Deflection IC with 7 terminals and 24V power supply. It operates b/w -20 °C to 85°C, suitable for TV applications due to its bipolar technology and flange mount package style.

Median Price

$9.184

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Freelance Electronics

USA . 246 parts In-Stock

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$9.184

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$9.643

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$9.092

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Digiode

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Vyrian

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ComSIT Distribution GmbH

Germany . 64 parts In-Stock

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ACDS - Activité Composants Distribution Service

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EMSNET

USA . 40 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 28 parts In-Stock

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Huijzer Components

Netherlands . 28 parts In-Stock

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LittleDiode

UK . 23 parts In-Stock

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R&J Components

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Goldney Electronics S.L.

Spain . 5 parts In-Stock

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GES GmbH

Germany . 3 parts In-Stock

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Donberg Electronics Ltd

Ireland . 1 parts In-Stock

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Corohmni

South Africa . 357 parts In-Stock

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Kulean Microsystems

USA . 7,545 parts In-Stock

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SupplyDigital Components

Austria . 4,548 parts In-Stock

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TANS Electronics

Latvia . 4,245 parts In-Stock

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Problanco Electronics

Mexico . 1,807 parts In-Stock

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Corphita

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Assy Fe

Spain . 1,008 parts In-Stock

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UHIMA Technologies

Türkiye . 542 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 40 parts In-Stock

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Overview

Transform your TV viewing experience with the LA7841 Vertical Deflection IC from Onsemi. Known for their high-quality manufacturing, Onsemi delivers reliable and efficient components that enhance your entertainment system. The LA7841 is designed to provide superior vertical deflection performance, ensuring crisp and clear images on your screen. Say goodbye to fuzzy pictures and hello to a more immersive viewing experience. Upgrade your TV with the LA7841 and discover the difference it can make in your entertainment setup.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and integration into various electronic devices.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection applications in TV sets, ensuring reliable performance.

Power Supplies (V): 24

Operating at 24V provides sufficient power for vertical deflection requirements in TV displays.

No. of Terminals: 7

Optimal number of terminals for connecting various components and ensuring proper functionality.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure installation and stability in TV sets.

Application: TV

Specifically designed for TV applications, ensuring compatibility and efficient performance.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures without compromising performance or reliability.

Minimum Operating Temperature: -20 °C

Can operate in cold environments without any negative impact on functionality.

Terminal Position: SINGLE

Single terminal position simplifies the connection process and ensures ease of integration.

Technology: BIPOLAR

Utilizes bipolar technology for efficient vertical deflection in TV displays.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and stability in TV sets.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm for easy soldering and connection to other components.

Technical Specifications

Vertical Deflection ICs LA7841 attributes and parameters. Explore more Vertical Deflection ICs devices from Onsemi

Specs

Application:

TV

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-XSFM-T7

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

SIP7,.05TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

LA7841 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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