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LA78041

Onsemi

LA78041 by Onsemi

LA78041 by Onsemi is a Vertical Deflection IC with 7 terminals and a power supply range of 16V to 33V. It operates b/w -20 °C to 85°C, making it suitable for TV applications due to its RECTANGULAR package style and ZIG-ZAG terminal position.

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Lifecycle Status

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Vyrian

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Cyclops Electronics Ltd

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LittleDiode

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Prism Electronics

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Kepictronics

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TANS Electronics

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Problanco Electronics

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Kulean Microsystems

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SupplyDigital Components

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Overview

Elevate your TV viewing experience with the LA78041 Vertical Deflection IC by Onsemi. Known for their superior quality and reliability, Onsemi's products are trusted by professionals worldwide. The LA78041 is perfect for enhancing the vertical deflection in your TV, providing crisp and clear images every time. With a wide operating temperature range and a compact package style, this IC offers unmatched value and performance. Upgrade your TV today with the LA78041 from Onsemi.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration and efficient use of space in electronic devices.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection applications in TVs, ensuring optimal performance in this specific function.

Power Supplies (V): 24

Operates at a standard power supply voltage of 24V, making it compatible with a wide range of TV systems.

No. of Terminals: 7

Sufficient number of terminals for connecting to various components and ensuring proper functionality.

Package Style: FLANGE MOUNT

Flange mount package style provides secure mounting and reliability in TV applications.

Application: TV

Specifically designed for use in TVs, ensuring compatibility and optimized performance in this context.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures without compromising performance, ensuring reliability and durability.

Minimum Operating Temperature: -20 °C

Capable of operating in low temperature environments, making it suitable for a wide range of operating conditions.

Terminal Position: ZIG-ZAG

Zig-zag terminal position facilitates easy connections and reduces the risk of short circuits.

Minimum Supply Voltage (Vsup): 16 V

Works efficiently at a minimum supply voltage of 16V, allowing for flexibility in power supply options.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures secure connections and easy soldering during installation.

Terminal Pitch: 1.27 mm

Optimal terminal pitch of 1.27mm for easy connection to other components and PCBs.

Maximum Supply Voltage (Vsup): 33 V

Supports a maximum supply voltage of 33V, providing a wide voltage range for compatibility with different systems.

Technical Specifications

Vertical Deflection ICs LA78041 attributes and parameters. Explore more Vertical Deflection ICs devices from Onsemi

Specs

Application:

TV

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-XZFM-T7

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

33 V

Minimum Supply Voltage (Vsup):

16 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

LA78041 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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