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TDA8179F

STMicroelectronics

TDA8179F by STMicroelectronics

TDA8179F by STMicroelectronics is a Vertical Deflection IC with 7 terminals, operating voltage of 10-48V. It has a rectangular package style made of plastic/epoxy material. Ideal for applications requiring vertical deflection in electronic circuits with temperature range from 0 to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,896 parts In-Stock

1+ parts

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4,896

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Anansix

USA . 2,520 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,520

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Vyrian

USA . 419 parts In-Stock

1+ parts

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100+ parts

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419

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 124 parts In-Stock

1+ parts

$0.267

100+ parts

-

1k+ parts

$0.240

10k+ parts

-

124

$0.267

-

$0.240

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MKK Technologies

India . 1,103 parts In-Stock

1+ parts

$0.502

100+ parts

-

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10k+ parts

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1,103

$0.502

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DigiPath Technology Company

USA . 1,103 parts In-Stock

1+ parts

$0.502

100+ parts

-

1k+ parts

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1,103

$0.502

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-

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Corphita

USA . 2,705 parts In-Stock

1+ parts

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2,705

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Parana Technologies

USA . 1,010 parts In-Stock

1+ parts

-

100+ parts

$0.319

1k+ parts

-

10k+ parts

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1,010

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$0.319

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Overview

Unlock the power of high-quality vertical deflection with the TDA8179F by STMicroelectronics. Designed to meet the highest standards, this IC offers unmatched reliability and performance. Ideal for a wide range of applications, this product provides exceptional value and benefits to customers seeking superior vertical deflection solutions. Experience the advantages of STMicroelectronics' expertise and innovation with the TDA8179F.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and protection for the internal components of the IC, making it suitable for long-term use.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on a circuit board, making it easier to integrate into various electronic devices.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection applications, ensuring optimal performance and reliability in devices such as TVs and monitors.

Power Supplies (V): 10/48

Versatile power supply options allow for compatibility with a range of devices, offering flexibility in design and implementation.

No. of Terminals: 7

Sufficient number of terminals for connecting to external components, facilitating easy installation and connections in electronic circuits.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance ensures stable performance even in demanding environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature tolerance allows for reliable operation in a wide range of temperature conditions, from cold to hot environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good conductivity and solderability, ensuring secure connections and efficient transmission of signals.

Terminal Position: ZIG-ZAG

ZIG-ZAG terminal positioning offers better stability and resistance to mechanical stress, reducing the risk of damage during handling and usage.

Terminal Form: THROUGH-HOLE

THROUGH-HOLE terminal form is well-suited for through-hole soldering, providing a reliable and secure connection to the circuit board.

Terminal Pitch: 1.27 mm

Standard terminal pitch size makes it compatible with commonly used PCB layouts and components, ensuring easy integration during assembly.

Technical Specifications

Vertical Deflection ICs TDA8179F attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T7

JESD-609 Code:

e0

No. of Terminals:

7

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.15,.2TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

10/48

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA8179F General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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