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TDA9108

STMicroelectronics

TDA9108 by STMicroelectronics

TDA9108 by STMicroelectronics is a horizontal deflection IC designed for monitors, operating b/w 10-13.2V with a max temp of 70 °C. It features a 14-terminal through-hole package and utilizes bipolar technology for efficient performance. Ideal for enhancing display quality in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,387

-

-

-

-

Anansix

USA . 1,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,075

-

-

-

-

Vyrian

USA . 545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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545

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,690 parts In-Stock

1+ parts

$1.041

100+ parts

-

1k+ parts

$0.936

10k+ parts

-

1,690

$1.041

-

$0.936

-

MKK Technologies

India . 1,420 parts In-Stock

1+ parts

$1.957

100+ parts

-

1k+ parts

-

10k+ parts

-

1,420

$1.957

-

-

-

DigiPath Technology Company

USA . 1,420 parts In-Stock

1+ parts

$1.957

100+ parts

-

1k+ parts

-

10k+ parts

-

1,420

$1.957

-

-

-

Corphita

USA . 4,866 parts In-Stock

1+ parts

-

100+ parts

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4,866

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-

-

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Kepictronics

USA . 90 parts In-Stock

1+ parts

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100+ parts

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90

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Parana Technologies

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$1.244

1k+ parts

-

10k+ parts

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60

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$1.244

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Overview

Elevate your display solutions with the TDA9108 from STMicroelectronics, a trusted leader in innovative electronics. This high-quality vertical deflection IC provides superior performance for monitor applications, ensuring crystal-clear visuals and reliability under demanding conditions. With robust design and excellent thermal stability, the TDA9108 empowers engineers to create efficient, long-lasting displays that enhance user experiences while reducing maintenance costs. Unlock the potential of your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it a reliable choice for long-term applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient PCB layout and space optimization, facilitating easier integration into various designs.

General IC Type: HORIZONTAL DEFLECTION IC

As a horizontal deflection IC, this product is specifically designed for monitor applications, ensuring optimal performance in display technologies.

Power Supplies (V): 12

Operating at a standard power supply of 12V makes it compatible with a wide range of existing systems and power configurations.

No. of Terminals: 14

Having 14 terminals enhances connectivity options, allowing for flexible design and integration with various components in a circuit.

Package Style (Meter): IN-LINE

In-line package style ensures ease of installation and minimizes the footprint on the PCB, making it ideal for compact applications.

Application: MONITOR

Designed specifically for monitor applications, this IC is optimized for use in display technologies, ensuring high-quality performance and reliability.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is suitable for various environments, making it a versatile choice for different applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures good solderability and durability during assembly, which is essential for maintaining connection integrity.

Terminal Position: DUAL

Dual terminal positioning aids in efficient signal routing and provides additional flexibility for circuit design.

Minimum Supply Voltage (Vsup): 10 V

The minimum supply voltage of 10V allows for compatibility with a wide range of power supply options, enhancing design flexibility.

Technology: BIPOLAR

Utilizing bipolar technology, this IC offers quick switching capabilities and high efficiency, making it suitable for high-performance applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical stability and is advantageous for applications requiring enhanced physical strength.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm facilitates easy placement and soldering, contributing to reliable connections in electronic circuits.

Maximum Supply Voltage (Vsup): 13.2 V

The maximum supply voltage of 13.2V allows for a wide voltage range, accommodating various system requirements and enhancing operational flexibility.

Technical Specifications

Vertical Deflection ICs TDA9108 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA9108 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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