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TDA9103

STMicroelectronics

TDA9103 by STMicroelectronics

TDA9103 by STMicroelectronics is a HORIZ/VERT DEFLECTION IC with 42 terminals and BICMOS technology. It operates b/w 0-70 °C, requires 10.8-13.2V power supplies, and draws a max of 60mA current. Ideal for MONITOR applications due to its IN-LINE package style and THROUGH-HOLE terminal form.

Median Price

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Lifecycle Status

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Vyrian

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Digiode

USA . 833 parts In-Stock

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Anansix

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Fibra_Brandt Electronic GMBH

Germany . 129 parts In-Stock

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MISTER SPROCKETS

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Cyclops Electronics Ltd

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Huijzer Components

Netherlands . 78 parts In-Stock

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Component Electronics Inc.

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Inventory MP

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Bristol Electronics

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Prism Electronics

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Mil-Aero Solutions, Inc.

USA . 26 parts In-Stock

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Inland Empire Components Inc.

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ComSIT Distribution GmbH

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Donberg Electronics Ltd

Ireland . 14 parts In-Stock

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Electronic Expediters

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LittleDiode

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MRC Electronics

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GES GmbH

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Corel Iberica Componentes, S.L.

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EMSNET

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IDEA Electronic Components Group

UK . 926 parts In-Stock

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MKK Technologies

India . 145 parts In-Stock

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$3.311

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DigiPath Technology Company

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A-Z Elektronik GmbH

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Perfect Parts

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GreenTree Electronics

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Corphita

USA . 3,221 parts In-Stock

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Kepictronics

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Parana Technologies

USA . 83 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Assy Fe

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Overview

Experience exceptional quality and reliability with the TDA9103 by STMicroelectronics, a leading manufacturer in the industry. This Vertical Deflection IC is perfect for monitor applications, offering a wide temperature range and efficient power supplies. With 42 terminals in an inline package style, this IC provides seamless integration and superior performance. Trust in the value and benefits that the TDA9103 brings to your electronics projects, delivering unmatched quality and precision every time. Elevate your designs with STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and thermal stability, ensuring a longer lifespan for the product.

General IC Type: HORIZ/VERT DEFLECTION IC

This specialized IC type is specifically designed for horizontal and vertical deflection applications, making it highly suitable for monitor usage.

Power Supplies (V): 12

Operating at 12V, this product provides a stable power supply for efficient performance.

No. of Terminals: 42

With a high number of terminals, this product offers versatile connectivity options for various circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and compact integration within monitor systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperatures, ensuring reliable performance under various conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures that this product can function effectively in colder environments as well.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good conductivity and solderability, enhancing the overall reliability of the product.

Technology: BICMOS

Utilizing BICMOS technology, this product offers a balance between bipolar and CMOS characteristics, resulting in improved performance and efficiency.

Maximum Supply Current: 60 mA

With a maximum supply current of 60 mA, this product consumes low power, making it energy-efficient and cost-effective.

Technical Specifications

Vertical Deflection ICs TDA9103 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T42

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

SDIP42,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

TDA9103 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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