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TDA8214

STMicroelectronics

TDA8214 by STMicroelectronics

TDA8214 by STMicroelectronics is a Vertical Deflection IC with 20 terminals, operating at -40 to 85 °C. It has a power supply of 10V and uses bipolar technology. This HORIZ/VERT DEFLECTION IC in RECTANGULAR PLASTIC/EPOXY package is ideal for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,854 parts In-Stock

1+ parts

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2,854

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Anansix

USA . 1,450 parts In-Stock

1+ parts

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1,450

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Digiode

USA . 142 parts In-Stock

1+ parts

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142

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Donberg Electronics Ltd

Ireland . 10 parts In-Stock

1+ parts

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1k+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,819 parts In-Stock

1+ parts

$2.626

100+ parts

-

1k+ parts

$2.363

10k+ parts

-

1,819

$2.626

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$2.363

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MKK Technologies

India . 1,288 parts In-Stock

1+ parts

$4.937

100+ parts

-

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1,288

$4.937

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DigiPath Technology Company

USA . 1,288 parts In-Stock

1+ parts

$4.937

100+ parts

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10k+ parts

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1,288

$4.937

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 1,789 parts In-Stock

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1,789

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Parana Technologies

USA . 553 parts In-Stock

1+ parts

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100+ parts

$3.139

1k+ parts

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553

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$3.139

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Overview

Upgrade your electronics with the TDA8214 Vertical Deflection IC by STMicroelectronics. Known for their top-quality manufacturing, STMicroelectronics delivers reliable and efficient components for a range of applications. The TDA8214 offers exceptional performance and durability, making it ideal for vertical deflection circuits. With its advanced technology and industrial-grade design, this IC ensures precise and stable operation in temperatures ranging from -40 to 85 °C. Trust STMicroelectronics to provide the value and benefits you need for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external elements, ensuring longevity and reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement within electronic circuits and systems.

General IC Type: HORIZ/VERT DEFLECTION IC

Specifically designed for horizontal and vertical deflection applications, ensuring optimal performance in such systems.

Power Supplies (V): 10

With a power supply of 10V, this IC is suitable for a wide range of electronic devices and applications.

No. of Terminals: 20

Having 20 terminals enables versatile connectivity options and compatibility with various circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style offers efficient space utilization and easy PCB layout design.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can withstand high-temperature environments and extended use.

Minimum Operating Temperature: -40 °C

Having a minimum operating temperature of -40 °C ensures reliable performance in cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good conductivity and solderability for secure connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit board layout and connection options.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certifies the reliability and durability of the IC in harsh operating conditions.

Technology: BIPOLAR

Bipolar technology ensures high-speed performance and efficiency in signal processing.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides mechanical stability and easy soldering during assembly.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54mm, this IC offers compatibility with standard PCB designs and components.

Technical Specifications

Vertical Deflection ICs TDA8214 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

10

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA8214 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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