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STV9381

STMicroelectronics

STV9381 by STMicroelectronics

STV9381 by STMicroelectronics is a vertical deflection IC designed for TVs and monitors, operating b/w ±12V. It features a compact 20-terminal package with a max temp of 70 °C and supports supply voltages from 10V to 18V. Ideal for efficient display control in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,324 parts In-Stock

1+ parts

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4,324

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Digiode

USA . 2,929 parts In-Stock

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2,929

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Anansix

USA . 778 parts In-Stock

1+ parts

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778

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 906 parts In-Stock

1+ parts

$3.214

100+ parts

-

1k+ parts

$2.893

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906

$3.214

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$2.893

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MKK Technologies

India . 467 parts In-Stock

1+ parts

$6.045

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467

$6.045

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DigiPath Technology Company

USA . 467 parts In-Stock

1+ parts

$6.045

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467

$6.045

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Kepictronics

USA . 3,520 parts In-Stock

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3,520

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Corphita

USA . 1,532 parts In-Stock

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1,532

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Parana Technologies

USA . 1,450 parts In-Stock

1+ parts

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100+ parts

$3.843

1k+ parts

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1,450

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$3.843

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Overview

Unlock exceptional performance in your TV and monitor designs with the STV9381 from STMicroelectronics. This cutting-edge vertical deflection IC is engineered for reliability, ensuring crisp image quality and seamless operation. With STMicroelectronics' renowned expertise and commitment to innovation, you can trust that the STV9381 will enhance your products while reducing complexity. Elevate your displays with a solution that promises durability and efficiency, delivering unmatched value to your customers!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental stresses, making this IC reliable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on printed circuit boards, which is critical in compact electronic designs.

General IC Type: VERTICAL DEFLECTION IC

Designed specifically for vertical deflection applications, this IC is specialized for TV and monitor usage, ensuring high performance in display technologies.

Power Supplies (V): +-12

Operating with a dual polarity voltage supply allows for greater versatility and compatibility with various circuit designs.

No. of Terminals: 20

With 20 terminals, this IC offers multiple connection options, allowing for complex circuit configurations and integration into various systems.

Package Style (Meter): IN-LINE

The in-line package style is ideal for easier mounting and assembly, enabling efficient integration into electronic devices.

Application: TV; MONITOR

Specifically intended for TVs and monitors, this IC meets the rigorous demands of display technology, ensuring reliable operation and image quality.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C indicates suitability for standard commercial environments, enhancing product longevity.

Minimum Operating Temperature: 0 °C

The ability to function from 0 °C ensures operational reliability in various climates, making it a versatile choice for diverse applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability, ensuring robust connections and minimizing the risk of corrosion.

Terminal Position: DUAL

Dual terminal positioning ensures better placement flexibility on PCB layouts, improving design efficiency and effectiveness.

Maximum Seated Height: 5.334 mm

With a low seated height, this IC is suited for low-profile designs, allowing for space-saving in electronic assemblies.

Width: 7.62 mm

The compact width of 7.62 mm contributes to the ability to create denser designs without compromising functionality.

Minimum Supply Voltage (Vsup): 10 V

A minimum supply voltage of 10V ensures compatibility with a wide range of power configurations, allowing for flexible applications.

Length: 26.162 mm

The length of 26.162 mm makes it suitable for various mounting scenarios, further creating options for designers.

Temperature Grade: COMMERCIAL

Being commercially rated ensures that the IC performs reliably under standard operational conditions typical of everyday devices.

Technology: BCDMOS

The BCDMOS technology combines analog, digital, and power functions, leading to enhanced performance, greater efficiency, and reduced power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and ease of soldering, making it advantageous for prototyping and production.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standardized, ensuring compatibility with various PCB designs, facilitating easier assembly and replacement.

Maximum Supply Voltage (Vsup): 18 V

A maximum supply voltage of 18V allows for flexibility in voltage selection, accommodating a range of operational requirements.

Technical Specifications

Vertical Deflection ICs STV9381 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.162 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-12

Qualification:

Not Qualified

Maximum Seated Height:

5.334 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

STV9381 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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