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TBA920S

STMicroelectronics

TBA920S by STMicroelectronics

STMicroelectronics TBA920S is a HORIZONTAL DEFLECTION IC with 12V power supply, 16 terminals, and BIPOLAR technology. It operates b/w -20 °C to 60°C, ideal for vertical deflection applications in commercial-grade electronics. The PLASTIC/EPOXY rectangular package with IN-LINE style and Tin/Lead finish makes it suitable for through-hole mounting at a pitch of 2.54mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Digiode

USA . 3,884 parts In-Stock

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Vyrian

USA . 2,170 parts In-Stock

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Anansix

USA . 1,702 parts In-Stock

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Halfin

Belgium . 783 parts In-Stock

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ECAB

Sweden . 639 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 166 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 85 parts In-Stock

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Huijzer Components

Netherlands . 34 parts In-Stock

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Goldney Electronics S.L.

Spain . 28 parts In-Stock

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LittleDiode

UK . 21 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 7 parts In-Stock

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GES GmbH

Germany . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 60 parts In-Stock

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$0.137

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$0.123

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60

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MKK Technologies

India . 197 parts In-Stock

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$0.258

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DigiPath Technology Company

USA . 197 parts In-Stock

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Corphita

USA . 2,059 parts In-Stock

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Parana Technologies

USA . 1,281 parts In-Stock

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Supply Digital

USA . 754 parts In-Stock

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Assy Fe

Spain . 463 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 135 parts In-Stock

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Overview

Elevate your electronics with the TBA920S from STMicroelectronics, a leading manufacturer known for their high-quality components. Designed for vertical deflection applications, this IC offers superior performance and reliability. With its durable plastic/epoxy package and commercial temperature grade, the TBA920S ensures optimal functionality in a variety of environments. Enhance your projects with ease using this versatile component that delivers exceptional value and benefits to customers seeking top-tier solutions. Upgrade to the TBA920S and experience the difference in quality and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC material makes the package lightweight and durable, reducing the overall weight of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement within electronic circuits or PCBs.

General IC Type: HORIZONTAL DEFLECTION IC

Specifically designed for horizontal deflection applications, ensuring efficient performance in that particular function.

Power Supplies (V): 12

Operates on a standard 12V power supply, making it compatible with various electronic systems.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and ensuring stable connections.

Package Style (Meter): IN-LINE

In-line package style allows for easy mounting and space-saving design in electronic devices.

Maximum Operating Temperature: 60 °C

Can operate efficiently at relatively high temperatures, ensuring stable performance in different environments.

Minimum Operating Temperature: -20 °C

Capable of functioning in low-temperature conditions without any performance degradation.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good conductivity and reliable connections in electronic circuits.

Terminal Position: DUAL

Dual terminal position allows for flexible installation and versatile connection options.

Temperature Grade: COMMERCIAL

Designed for use in commercial applications, ensuring reliability and consistency in performance.

Technology: BIPOLAR

Bipolar technology offers high-speed switching and precise control, making it suitable for vertical deflection applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies the assembly process and provides sturdy connections to the PCB.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy soldering and connection to the PCB, ensuring compatibility with various circuit designs.

Technical Specifications

Vertical Deflection ICs TBA920S attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TBA920S General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-251-1520, 5962012511520, 5962-12-322-8719, 5962123228719

NIIN

012511520, 123228719

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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