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TEA2031A

STMicroelectronics

TEA2031A by STMicroelectronics

TEA2031A by STMicroelectronics is a bipolar EAST-WEST correction IC designed for TV applications. It operates with a supply voltage range of 16-35V and features an 8-terminal in-line package. Its compact dimensions include a max height of 5.08mm and width of 7.62mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

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Vyrian

USA . 8,056 parts In-Stock

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ECAB

Sweden . 3,502 parts In-Stock

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Digiode

USA . 3,194 parts In-Stock

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Anansix

USA . 938 parts In-Stock

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GES GmbH

Germany . 343 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 336 parts In-Stock

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LittleDiode

UK . 93 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 9 parts In-Stock

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Huijzer Components

Netherlands . 5 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Q Components

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IDEA Electronic Components Group

UK . 2,039 parts In-Stock

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$2.999

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$2.699

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MKK Technologies

India . 508 parts In-Stock

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$5.640

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DigiPath Technology Company

USA . 508 parts In-Stock

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AZTECH Wire

Italy . 849 parts In-Stock

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Kepictronics

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Microchip USA

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Corphita

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Parana Technologies

USA . 1,231 parts In-Stock

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Assy Fe

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Overview

Transform your TV's performance with the TEA2031A from STMicroelectronics—a trusted leader in semiconductor innovation. This advanced Vertical Deflection IC enhances picture quality, ensuring vivid and immersive viewing experiences. Designed for reliability, it seamlessly integrates into your television systems, offering superior east-west correction while optimizing power efficiency. Choose TEA2031A for unmatched durability and cutting-edge technology that elevates entertainment to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and resistance to environmental factors, ensuring longevity in various applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB, making it easier to incorporate into compact designs.

General IC Type: EAST-WEST CORRECTION IC

Specialized for east-west correction, this IC is ideal for television applications, enhancing image quality.

Power Supplies (V): 24

A nominal supply voltage of 24V ensures compatibility with standard television circuits, providing stable operation.

No. of Terminals: 8

Eight terminals offer sufficient connectivity for various functions while keeping the design simple and effective.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy integration into existing PCB layouts, streamlining design processes.

Application: TV

Specifically designed for TV applications, this IC is optimized for performance in consumer electronics.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability, providing reliable connections for improved device performance.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options on the PCB, contributing to design efficiency.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm keeps the component low-profile, beneficial for space-constrained applications.

Width: 7.62 mm

The width of 7.62 mm strikes a balance between compactness and ease of handling during assembly.

Minimum Supply Voltage (Vsup): 16 V

A minimum supply voltage of 16V ensures compatibility with a range of power supply designs while allowing for headroom.

Technology: BIPOLAR

Bipolar technology provides fast switching and high-speed operation, ideal for precise image correction applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers robust mechanical stability and reliable solder joints in demanding applications.

Maximum Supply Current: 6 mA

A low maximum supply current of 6 mA contributes to energy efficiency, making it suitable for power-sensitive designs.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this IC is compatible with standard PCB designs, simplifying layout and assembly.

Maximum Supply Voltage (Vsup): 35 V

Supporting a maximum supply voltage of 35V provides design flexibility and allows for a wider range of applications.

Technical Specifications

Vertical Deflection ICs TEA2031A attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Deflection ICs

Maximum Supply Current:

6 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

16 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TEA2031A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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