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TDA8177

STMicroelectronics

TDA8177 by STMicroelectronics

TDA8177 by STMicroelectronics is a Vertical Deflection IC with 7 terminals, operating voltage range of 10-35V. It has a temperature range of -20 to 75 °C and comes in a rectangular plastic package. Used for vertical deflection applications in commercial electronics.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 23 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

1k+ parts

$2.500

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23

$3.850

$2.880

$2.500

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Digiode

USA . 4,302 parts In-Stock

1+ parts

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4,302

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Anansix

USA . 2,510 parts In-Stock

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2,510

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Vyrian

USA . 2,405 parts In-Stock

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2,405

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Bristol Electronics

USA . 406 parts In-Stock

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406

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Atlantic Semiconductor

USA . 406 parts In-Stock

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406

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Extreme Components

USA . 100 parts In-Stock

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100

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R&J Components

USA . 50 parts In-Stock

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50

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LIBRA Elektronik GmbH

Germany . 50 parts In-Stock

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50

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Huijzer Components

Netherlands . 22 parts In-Stock

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22

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LittleDiode

UK . 18 parts In-Stock

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18

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Q Components

USA . 17 parts In-Stock

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17

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Fibra_Brandt Electronic GMBH

Germany . 11 parts In-Stock

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11

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Odyssey Electronics LTD

USA . 8 parts In-Stock

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8

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ECAB

Sweden . 5 parts In-Stock

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5

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GES GmbH

Germany . 4 parts In-Stock

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4

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Corel Iberica Componentes, S.L.

Spain . 3 parts In-Stock

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3

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Resion

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,486 parts In-Stock

1+ parts

$3.267

100+ parts

-

1k+ parts

$2.940

10k+ parts

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1,486

$3.267

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$2.940

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MKK Technologies

India . 732 parts In-Stock

1+ parts

$6.143

100+ parts

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732

$6.143

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DigiPath Technology Company

USA . 732 parts In-Stock

1+ parts

$6.143

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732

$6.143

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A-Z Elektronik GmbH

Germany . 6,236 parts In-Stock

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6,236

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 2,620 parts In-Stock

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2,620

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Parana Technologies

USA . 1,710 parts In-Stock

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$3.906

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1,710

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$3.906

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Assy Fe

Spain . 376 parts In-Stock

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376

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A-Plus Industry Inc.

USA . 6 parts In-Stock

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6

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Overview

Elevate your electronic devices to new heights with the TDA8177 Vertical Deflection IC by STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics delivers innovative solutions for a wide range of applications. The TDA8177 offers customers exceptional value and benefits, ensuring smooth vertical deflection performance. Say goodbye to subpar results and hello to top-tier functionality with the TDA8177 from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it a good choice for long-term use.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various electronic devices, making it a versatile and practical choice.

General IC Type: VERTICAL DEFLECTION IC

Being specifically designed for vertical deflection applications, this IC is optimized for efficient and accurate performance in such systems.

Power Supplies (V): 10/35

With compatible power supplies of 10V to 35V, this IC can be easily integrated into a wide range of electronic systems, providing flexibility in usage.

No. of Terminals: 7

The 7 terminals allow for easy connectivity and integration, simplifying the installation process and reducing potential errors.

Package Style (Meter): FLANGE MOUNT

The flange mount package style facilitates secure and stable mounting, ensuring proper connection and operation in various environments.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75 °C, this IC can withstand high temperatures without compromising its performance, increasing its longevity and reliability.

Minimum Operating Temperature: -20 °C

The IC's ability to operate at temperatures as low as -20 °C makes it suitable for use in a variety of environments, including those with colder conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides a reliable and stable connection, reducing the risk of signal loss or interference, enhancing the performance of the IC.

Terminal Position: ZIG-ZAG

The zig-zag terminal position allows for efficient use of space and easy routing of connections, optimizing the overall layout and design of the electronic system.

Minimum Supply Voltage (Vsup): 10 V

The minimum supply voltage of 10V ensures compatibility with a wide range of power sources, making it a versatile choice for various applications.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures reliable performance in a wide range of commercial applications, making it a dependable choice for business use.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy and secure installation on PCBs, providing stability and reliability in the connection.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and compact placement of the IC on a PCB, optimizing space utilization and enhancing overall system efficiency.

Maximum Supply Voltage (Vsup): 35 V

With a maximum supply voltage of 35V, this IC can handle higher power requirements and voltages, making it suitable for a wide range of electronic systems.

Technical Specifications

Vertical Deflection ICs TDA8177 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

10/35

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA8177 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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