Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TDA8177 by STMicroelectronics is a Vertical Deflection IC with 7 terminals, operating voltage range of 10-35V. It has a temperature range of -20 to 75 °C and comes in a rectangular plastic package. Used for vertical deflection applications in commercial electronics.
Median Price
$3.850
Lifecycle Status
Suppliers In-Stock
18
In-Stock Inventory
1k+
Component Electronics Inc.
1+ parts
100+ parts
$2.880
1k+ parts
$2.500
10k+ parts
-
Digiode
Anansix
Vyrian
Bristol Electronics
Atlantic Semiconductor
Extreme Components
R&J Components
LIBRA Elektronik GmbH
Huijzer Components
LittleDiode
Q Components
Fibra_Brandt Electronic GMBH
Odyssey Electronics LTD
ECAB
GES GmbH
Corel Iberica Componentes, S.L.
Resion
IDEA Electronic Components Group
$3.267
$2.940
MKK Technologies
$6.143
DigiPath Technology Company
A-Z Elektronik GmbH
Kepictronics
Authorized Procurement Solutions
Corphita
Parana Technologies
$3.906
Assy Fe
A-Plus Industry Inc.
The use of plastic/epoxy material ensures durability and reliability of the product, making it a good choice for long-term use.
The rectangular package shape allows for easy mounting and integration into various electronic devices, making it a versatile and practical choice.
Being specifically designed for vertical deflection applications, this IC is optimized for efficient and accurate performance in such systems.
With compatible power supplies of 10V to 35V, this IC can be easily integrated into a wide range of electronic systems, providing flexibility in usage.
The 7 terminals allow for easy connectivity and integration, simplifying the installation process and reducing potential errors.
The flange mount package style facilitates secure and stable mounting, ensuring proper connection and operation in various environments.
With a maximum operating temperature of 75 °C, this IC can withstand high temperatures without compromising its performance, increasing its longevity and reliability.
The IC's ability to operate at temperatures as low as -20 °C makes it suitable for use in a variety of environments, including those with colder conditions.
The tin lead terminal finish provides a reliable and stable connection, reducing the risk of signal loss or interference, enhancing the performance of the IC.
The zig-zag terminal position allows for efficient use of space and easy routing of connections, optimizing the overall layout and design of the electronic system.
The minimum supply voltage of 10V ensures compatibility with a wide range of power sources, making it a versatile choice for various applications.
The commercial extended temperature grade ensures reliable performance in a wide range of commercial applications, making it a dependable choice for business use.
The through-hole terminal form allows for easy and secure installation on PCBs, providing stability and reliability in the connection.
The 1.27mm terminal pitch allows for precise and compact placement of the IC on a PCB, optimizing space utilization and enhancing overall system efficiency.
With a maximum supply voltage of 35V, this IC can handle higher power requirements and voltages, making it suitable for a wide range of electronic systems.
Vertical Deflection ICs TDA8177 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics
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TDA8177 General Purpose ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
1N4148
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
LL4148
Taitron Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
MBRS340T3G
Onsemi
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Texas Instruments
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
General Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Bkc Semiconductors
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
LM358N
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Gec Plessey Semiconductors
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
TDA4853/V1
HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 32; Package Code: SDIP; Package Shape: RECTANGULAR;
TDA9103S
STMicroelectronics
TDA9103S by STMicroelectronics is a versatile horiz/vert deflection IC designed for monitors. It features a compact 42-terminal design with a max height of 5.08 mm, and comes in a rectangular plastic/epoxy package. Ideal for efficient display control applications.
SDA9361
Infineon Technologies
HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
TDA8214
TDA8214 by STMicroelectronics is a Vertical Deflection IC with 20 terminals, operating at -40 to 85 °C. It has a power supply of 10V and uses bipolar technology. This HORIZ/VERT DEFLECTION IC in RECTANGULAR PLASTIC/EPOXY package is ideal for industrial applications.
STV9383
STV9383 by STMicroelectronics is a vertical deflection IC designed for TVs and monitors, operating b/w ±12V. It features a compact 20-terminal package with a max temp of 70 °C and supports supply voltages from 10V to 18V. Ideal for reliable performance in commercial applications.
KB2147
Samsung
HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR;
TDA4851N
HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
TDA4864AJ
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR;
TA8638N
Toshiba
HORIZ/VERT DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 13.2 V;
TA8427K
VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Shape: RECTANGULAR; Terminal Finish: Tin/Lead (Sn/Pb);
TDA4866J
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA4854/V2
TDA4854/V2/S1
TDA4858
TDA9103
TDA9103 by STMicroelectronics is a HORIZ/VERT DEFLECTION IC with 42 terminals and BICMOS technology. It operates b/w 0-70 °C, requires 10.8-13.2V power supplies, and draws a max of 60mA current. Ideal for MONITOR applications due to its IN-LINE package style and THROUGH-HOLE terminal form.
TDA8359J
VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: ZIP; Package Shape: RECTANGULAR;
LA7841-E
VERTICAL DEFLECTION IC; Terminal Finish: Tin/Bismuth (Sn/Bi); JESD-609 Code: e6;
935261155112
TDA1170N
TDA1170N by STMicroelectronics is a Vertical Deflection IC with 12 terminals, operating voltage range of 10-35V. It is used in TV and monitor applications, featuring bipolar technology and through-hole terminal form. The package style is in-line rectangular made of plastic/epoxy material.
TDA8175
TDA8175 from STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates at a max supply voltage of 35V, with a temp range of -40 °C to 150°C. This automotive-grade component features a 7-terminal, flange mount design for reliable performance.
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TDA8172
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR; Package Equivalence Code: ZIP7,.15,.2TB;
TDA8146
EAST-WEST CORRECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
VERTICAL DEFLECTION IC; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA8174
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 11; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA8170
VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PZFM-T7;
TDA8177F
VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA8140
HORIZONTAL DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TDA8173
VERTICAL DEFLECTION IC; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TDA8147
EAST-WEST CORRECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TDA8174W
TDA8174A
TDA8147S
EAST-WEST CORRECTION IC; Temperature Grade: OTHER; No. of Terminals: 9; Package Body Material: PLASTIC/EPOXY; Maximum Supply Current: 7 mA; Terminal Finish: Tin/Lead (Sn/Pb);
TDA8176
VERTICAL DEFLECTION IC; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 15; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA8145
TDA8171
TDA8102B
HORIZ/VERT DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 15.5 V;
TDA8143
HORIZONTAL DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Qualification: Not Qualified;
TDA8147M
TDA8174AW
VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR;
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