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STV9303

STMicroelectronics

STV9303 by STMicroelectronics

STV9303 by STMicroelectronics is a vertical deflection IC designed for TV applications. It operates at a max supply voltage of 35V and features a 10-terminal flange mount in a rectangular plastic/epoxy package. Its single terminal form ensures easy integration into electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,984 parts In-Stock

1+ parts

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4,984

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Anansix

USA . 1,438 parts In-Stock

1+ parts

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-

1k+ parts

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1,438

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Vyrian

USA . 139 parts In-Stock

1+ parts

-

100+ parts

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139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 532 parts In-Stock

1+ parts

$1.629

100+ parts

-

1k+ parts

$1.466

10k+ parts

-

532

$1.629

-

$1.466

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MKK Technologies

India . 2,319 parts In-Stock

1+ parts

$3.064

100+ parts

-

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10k+ parts

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2,319

$3.064

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DigiPath Technology Company

USA . 2,319 parts In-Stock

1+ parts

$3.064

100+ parts

-

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10k+ parts

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2,319

$3.064

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-

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Corphita

USA . 2,325 parts In-Stock

1+ parts

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2,325

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Parana Technologies

USA . 1,713 parts In-Stock

1+ parts

-

100+ parts

$1.948

1k+ parts

-

10k+ parts

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1,713

-

$1.948

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Overview

Elevate your TV's performance with the STV9303 from STMicroelectronics, a trusted leader in innovative electronic solutions. Designed for outstanding vertical deflection, this IC ensures crisp, clear images while maximizing energy efficiency. Its robust plastic/epoxy construction and easy flange mount design make installation a breeze. Experience unparalleled reliability and superior quality, essential for any home entertainment system. Unlock the full potential of your displays today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on printed circuit boards (PCBs) and supports easy integration into designs.

General IC Type: VERTICAL DEFLECTION IC

Designed specifically for vertical deflection applications, ensuring optimal performance in TV systems.

Power Supplies: 35 V

With a power supply rating of 35 V, this IC can operate effectively under high voltage conditions, ensuring reliability.

No. of Terminals: 10

A 10-terminal design facilitates multiple connections, allowing for flexibility in circuit design and component integration.

Package Style (Meter): FLANGE MOUNT

Flange mount design aids in securing the IC firmly to the PCB, enhancing stability and reducing the risk of damage.

Application: TV

Specifically engineered for TV applications, ensuring compatibility and optimized performance in consumer electronics.

Terminal Finish: TIN LEAD

Tin lead finish provides excellent solderability and ensures reliable electrical connections, contributing to product longevity.

Terminal Position: SINGLE

Single terminal position simplifies layout and routing on the PCB, promoting design efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance mechanical strength and ensure robust connections, ideal for high-stress environments.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is a standard spacing that simplifies layout and assembly processes, making it accessible for designers.

Maximum Supply Voltage (Vsup): 35 V

The capability to handle a maximum supply voltage of 35 V ensures the IC operates reliably under various conditions, making it a robust choice for TV applications.

Technical Specifications

Vertical Deflection ICs STV9303 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PSFM-T10

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

10

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP10,.06TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

35

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

35 V

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STV9303 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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