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STK79315A

Onsemi

STK79315A by Onsemi

STK79315A by Onsemi is a Vertical Deflection IC with 18 terminals in PLASTIC/EPOXY package. It features HYBRID technology, 2.54 mm terminal pitch, and SINGLE terminal position. Ideal for vertical deflection applications in electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,326 parts In-Stock

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1,326

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Digiode

USA . 699 parts In-Stock

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699

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ComSIT Distribution GmbH

Germany . 29 parts In-Stock

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29

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GES GmbH

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,783 parts In-Stock

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7,783

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TANS Electronics

Latvia . 6,294 parts In-Stock

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6,294

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SupplyDigital Components

Austria . 5,929 parts In-Stock

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5,929

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Kulean Microsystems

USA . 3,427 parts In-Stock

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3,427

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UHIMA Technologies

Türkiye . 605 parts In-Stock

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605

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Corohmni

South Africa . 206 parts In-Stock

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206

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Corphita

USA . 87 parts In-Stock

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87

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Overview

Elevate your electronic devices to the next level with the STK79315A by Onsemi. Designed with precision and excellence, this Vertical Deflection IC offers unparalleled performance and reliability. Whether you're working on a TV, monitor, or other display equipment, this hybrid technology IC delivers exceptional results. Trust in Onsemi's reputation for quality and innovation to bring value and benefits to your projects. Upgrade your vertical deflection system today with the STK79315A.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy material for the package body ensures durability and reliability of the Vertical Deflection IC, making it suitable for long-term use in various electronic devices.

General IC Type: VERTICAL DEFLECTION IC

The specific design for vertical deflection makes this IC ideal for applications where precise vertical positioning and control of display elements are required, such as in televisions and computer monitors.

No. of Terminals: 18

Having 18 terminals allows for more connectivity options and functionalities, enabling the Vertical Deflection IC to interface with various external components in a system.

Terminal Position: SINGLE

A single terminal position simplifies the installation and connection process of the IC, reducing the chances of errors and making it easier to integrate into electronic circuits.

Technology: HYBRID

The hybrid technology used in this Vertical Deflection IC combines the advantages of different technologies, resulting in enhanced performance, reliability, and efficiency.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch provides a standardized spacing for the terminals, allowing for easier compatibility with existing connectors and PCB layouts, facilitating seamless integration into electronic systems.

Technical Specifications

Vertical Deflection ICs STK79315A attributes and parameters. Explore more Vertical Deflection ICs devices from Onsemi

Specs

General IC Type:

No. of Terminals:

18

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP18,.1

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Surface Mount:

NO

Technology:

HYBRID

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STK79315A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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