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TDA9105S

STMicroelectronics

TDA9105S by STMicroelectronics

TDA9105S by STMicroelectronics is a versatile horiz/vert deflection IC designed for monitors. It features a compact 42-terminal package with a max height of 5.08 mm, and its dual terminal position ensures efficient performance in display applications. Ideal for enhancing image quality in CRT displays.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,127 parts In-Stock

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4,127

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Anansix

USA . 1,495 parts In-Stock

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1,495

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,412 parts In-Stock

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1,412

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Digiode

USA . 1,071 parts In-Stock

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1,071

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 531 parts In-Stock

1+ parts

$1.281

100+ parts

-

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$1.153

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531

$1.281

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$1.153

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MKK Technologies

India . 632 parts In-Stock

1+ parts

$2.408

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632

$2.408

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DigiPath Technology Company

USA . 632 parts In-Stock

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$2.408

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632

$2.408

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Parana Technologies

USA . 659 parts In-Stock

1+ parts

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$1.531

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659

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$1.531

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Corphita

USA . 91 parts In-Stock

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91

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Overview

Elevate your display technology with the TDA9105S from STMicroelectronics—your trusted partner in innovation and quality. This advanced Vertical Deflection IC is engineered for superior performance in monitors, ensuring crystal-clear visuals and enhanced user experience. With STMicroelectronics' commitment to excellence and reliability, the TDA9105S not only meets industry standards but exceeds them, providing you with exceptional value and efficiency for your electronic applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making the IC reliable for long-term applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on circuit boards, facilitating easier integration into various designs.

General IC Type: HORIZ/VERT DEFLECTION IC

As a horizontal/vertical deflection IC, it is specifically designed to provide precise control for monitor applications, ensuring high-quality display performance.

No. of Terminals: 42

With 42 terminals, this IC offers a robust connectivity option, allowing for various configurations and functionalities required in complex circuits.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch design optimizes space and enhances the routing options on the PCB, making assembly easier and more efficient.

Application: MONITOR

Specifically designed for monitor applications, this IC meets the unique requirements of display technology, ensuring compatibility and optimal performance.

Terminal Position: DUAL

The dual terminal position provides flexibility in board layout design, which can simplify the assembly process and improve signal integrity.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm keeps the component low-profile, allowing for better airflow and reducing heat buildup within the device.

Width: 15.24 mm

A width of 15.24 mm strikes a balance between compactness and ease of handling, promoting suitability for standard PCB designs.

Length: 36.83 mm

The length of 36.83 mm provides sufficient terminal spacing for easy soldering and reduces the risk of short circuits during assembly.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical strength and provides secure connections, making the IC suitable for various mounting requirements.

Terminal Pitch: 1.778 mm

The 1.778 mm terminal pitch allows for effective signal routing and minimizes signal degradation over distance, improving overall performance.

Technical Specifications

Vertical Deflection ICs TDA9105S attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

MONITOR

General IC Type:

JESD-30 Code:

R-PDIP-T42

Length:

36.83 mm

No. of Functions:

1

No. of Terminals:

42

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TDA9105S General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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