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STV8172A

STMicroelectronics

STV8172A by STMicroelectronics

STV8172A by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates with a supply voltage range of 10-35 V, features 7 terminals in a zig-zag position, and utilizes bipolar technology. Its compact flange mount design ensures efficient performance.

Median Price

$0.730

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Ozdisan Elektronik

Türkiye . 59 parts In-Stock

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$0.730

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59

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Q Components

USA . 6,900 parts In-Stock

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6,900

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Vyrian

USA . 2,408 parts In-Stock

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2,408

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Digiode

USA . 1,457 parts In-Stock

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1,457

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LIBRA Elektronik GmbH

Germany . 450 parts In-Stock

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450

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Anansix

USA . 401 parts In-Stock

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401

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Zilex Electronics Inc.

Canada . 148 parts In-Stock

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148

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LittleDiode

UK . 3 parts In-Stock

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Donberg Electronics Ltd

Ireland . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 504 parts In-Stock

1+ parts

$3.638

100+ parts

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$3.274

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504

$3.638

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$3.274

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MKK Technologies

India . 2,268 parts In-Stock

1+ parts

$6.840

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2,268

$6.840

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DigiPath Technology Company

USA . 2,268 parts In-Stock

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$6.840

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$6.840

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A-Z Elektronik GmbH

Germany . 7,274 parts In-Stock

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Corphita

USA . 2,800 parts In-Stock

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2,800

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Kepictronics

USA . 1,870 parts In-Stock

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1,870

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Parana Technologies

USA . 1,402 parts In-Stock

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$4.349

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$4.349

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GreenTree Electronics

Israel . 1,235 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Elevate your display technology with the STV8172A from STMicroelectronics, a leading name in innovative electronics. This robust Vertical Deflection IC ensures exceptional performance for TVs and monitors, delivering superior image quality and reliability. With its versatile design and efficient power management, the STV8172A enhances viewing experiences while reducing energy consumption. Trust in STMicroelectronics’ expertise for cutting-edge solutions that bring your displays to life!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight, durable package that is resistant to various environmental factors, making it suitable for long-lasting performance.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and easy integration into various designs.

General IC Type: VERTICAL DEFLECTION IC

Specialized for vertical deflection applications, this IC ensures optimal performance in TV and monitor displays, making it the ideal choice for these devices.

Power Supplies: 10/35 V

The wide power supply range supports versatility in design, accommodating various operational requirements and enhancing compatibility with different systems.

Number of Terminals: 7

With 7 terminals, this IC allows for multiple connectivity options, facilitating easier circuit integration and enhancing functionality.

Package Style: FLANGE MOUNT

The flange mount style provides a reliable mounting solution, ensuring stability and reducing the risk of mechanical stress during operation.

Application: TV; MONITOR

Designed specifically for televisions and monitors, this IC delivers high-quality vertical deflection performance, ensuring excellent display quality.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning optimizes space and enhances interconnectedness, making it more effective for complex circuits.

Minimum Supply Voltage: 10 V

A minimum supply voltage of 10 V ensures low operational requirements, which can lead to energy savings in applications.

Technology: BIPOLAR

Bipolar technology offers fast switching speeds and high gain, making this IC effective in handling rapid electronic signals.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust connections and are ideal for applications requiring strong mechanical bonds.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA allows for enhanced performance while maintaining efficiency, suitable for various driving circuits.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch offers compact footprint and precise soldering, supporting tighter space utilization on printed circuit boards.

Maximum Supply Voltage: 35 V

Capable of handling up to 35 V ensures robustness and reliability under varying operational conditions, enhancing product lifespan.

Technical Specifications

Vertical Deflection ICs STV8172A attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T7

No. of Functions:

1

No. of Terminals:

7

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

10/35

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

STV8172A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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