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LA78041-E

Onsemi

LA78041-E by Onsemi

LA78041-E by Onsemi is a Vertical Deflection IC with 24V power supply, 7 terminals, and operating temperatures from -20 °C to 85°C. Its package style is IN-LINE and terminal finish is TIN BISMUTH. This IC is commonly used in CRT monitors for vertical deflection control.

Median Price

$0.674

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 75 parts In-Stock

1+ parts

-

100+ parts

$0.674

1k+ parts

$0.559

10k+ parts

$0.498

75

-

$0.674

$0.559

$0.498

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 354 parts In-Stock

1+ parts

$0.524

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-

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354

$0.524

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Vyrian

USA . 8,789 parts In-Stock

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8,789

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Distributors (Availability)

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Corphita

USA . 2,137 parts In-Stock

1+ parts

$0.497

100+ parts

-

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2,137

$0.497

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-

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Corohmni

South Africa . 295 parts In-Stock

1+ parts

$0.552

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295

$0.552

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AZTECH Wire

Italy . 350 parts In-Stock

1+ parts

$18.080

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350

$18.080

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TANS Electronics

Latvia . 7,537 parts In-Stock

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7,537

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SupplyDigital Components

Austria . 7,537 parts In-Stock

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Problanco Electronics

Mexico . 3,369 parts In-Stock

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3,369

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Kulean Microsystems

USA . 1,636 parts In-Stock

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1,636

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Perfect Parts

USA . 503 parts In-Stock

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503

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Microchip USA

USA . 221 parts In-Stock

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221

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UHIMA Technologies

Türkiye . 125 parts In-Stock

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125

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Overview

Enhance your display performance with the LA78041-E Vertical Deflection IC by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge technology that ensures optimal functionality in a variety of applications. The LA78041-E offers customers unparalleled value and benefits, providing seamless vertical deflection with precision and efficiency. Upgrade your electronics with this innovative product and experience the advantages of Onsemi's expertise in vertical deflection ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable casing for the IC, making it suitable for various applications without adding unnecessary weight.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board, maximizing the functionality of the product.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection applications, ensuring optimized performance in this particular function.

Power Supplies (V): 24

Operating at a relatively low voltage of 24V, making it energy-efficient and suitable for a wide range of devices.

No. of Terminals: 7

Having 7 terminals provides flexibility in connecting the IC to other components in the circuit, allowing for versatile integration.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85 °C, ensuring stability and reliability even in challenging environments.

Minimum Operating Temperature: -20 °C

Capable of operating at low temperatures down to -20 °C, making it suitable for a wide range of operating conditions.

Terminal Finish: TIN BISMUTH

Tin bismuth finish on terminals provides excellent conductivity and corrosion resistance, ensuring longevity and performance of the IC.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning allows for secure connections and efficient heat dissipation, enhancing the overall performance and lifespan of the IC.

Terminal Form: THROUGH-HOLE

Through-hole terminals make it easy to solder the IC onto a circuit board, ensuring a reliable and stable connection.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, it offers compatibility with standard spacing on most circuit boards, facilitating easy integration.

Technical Specifications

Vertical Deflection ICs LA78041-E attributes and parameters. Explore more Vertical Deflection ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T7

JESD-609 Code:

e6

No. of Terminals:

7

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

LA78041-E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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