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E-STV8172A

STMicroelectronics

E-STV8172A by STMicroelectronics

E-STV8172A by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It features a 7-terminal zig-zag layout, operates with a supply voltage range of 10-35 V, and comes in a flange mount rectangular package. Ideal for enhancing display performance in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Q Components

USA . 6,900 parts In-Stock

1+ parts

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6,900

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Vyrian

USA . 3,797 parts In-Stock

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3,797

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Anansix

USA . 1,096 parts In-Stock

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1,096

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Digiode

USA . 82 parts In-Stock

1+ parts

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82

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 467 parts In-Stock

1+ parts

$1.115

100+ parts

-

1k+ parts

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467

$1.115

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Northwest PG Solutions

USA . 1,679 parts In-Stock

1+ parts

$1.226

100+ parts

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1,679

$1.226

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IDEA Electronic Components Group

UK . 1,860 parts In-Stock

1+ parts

$1.840

100+ parts

-

1k+ parts

$1.656

10k+ parts

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1,860

$1.840

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$1.656

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MKK Technologies

India . 384 parts In-Stock

1+ parts

$3.460

100+ parts

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384

$3.460

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DigiPath Technology Company

USA . 384 parts In-Stock

1+ parts

$3.460

100+ parts

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384

$3.460

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Parana Technologies

USA . 1,143 parts In-Stock

1+ parts

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100+ parts

$2.200

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1,143

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$2.200

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Corphita

USA . 244 parts In-Stock

1+ parts

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244

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Overview

Elevate your display quality with the E-STV8172A from STMicroelectronics, a leader in innovative semiconductor solutions. This robust Vertical Deflection IC ensures superior performance for TVs and monitors, delivering exceptional image stability and clarity. With its reliable design and durable construction, it enhances viewing experiences while simplifying integration in your devices. Choose E-STV8172A for unmatched value, efficiency, and reliability that sets your products apart!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for long-term use in televisions and monitors.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space usage on printed circuit boards (PCBs), facilitating easy integration into various electronic designs.

General IC Type: VERTICAL DEFLECTION IC

As a dedicated vertical deflection IC, it is optimized for controlling the vertical deflection of electron beams, ensuring high-quality video display in TVs and monitors.

No. of Terminals: 7

Having 7 terminals provides flexibility for various connection configurations, making it compatible with a range of circuit designs.

Package Style (Meter): FLANGE MOUNT

The flange mount style enhances mechanical stability and ease of mounting, ensuring reliable operation in different working environments.

Application: TV; MONITOR

Designed specifically for TVs and monitors, the IC is tailored to meet the needs of display technologies, ensuring optimal performance in video output.

Terminal Position: ZIG-ZAG

The zig-zag terminal position allows for better soldering and space efficiency on the PCB, contributing to a more compact design.

Minimum Supply Voltage (Vsup): 10 V

A minimum supply voltage of 10 V provides sufficient power for operation while ensuring energy efficiency in various electronic appliances.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical support and are ideal for high-power applications, enhancing reliability.

Maximum Supply Voltage (Vsup): 35 V

With a maximum supply voltage of 35 V, the IC can accommodate a wide range of applications, ensuring versatility and reliability under varied voltage conditions.

Technical Specifications

Vertical Deflection ICs E-STV8172A attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T7

No. of Functions:

1

No. of Terminals:

7

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Terminal Form:

Terminal Position:

ZIG-ZAG

Trade Compliance

E-STV8172A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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