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STV9326

STMicroelectronics

STV9326 by STMicroelectronics

STV9326 by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates with a supply voltage range of 10-30 V, features 7 terminals in a flange mount package, and utilizes bipolar technology. Its compact design ensures efficient performance in display applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,936 parts In-Stock

1+ parts

-

100+ parts

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1,936

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-

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Digiode

USA . 625 parts In-Stock

1+ parts

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625

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Vyrian

USA . 153 parts In-Stock

1+ parts

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153

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Chip Stock

USA . 145 parts In-Stock

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145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 866 parts In-Stock

1+ parts

$1.139

100+ parts

-

1k+ parts

$1.025

10k+ parts

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866

$1.139

-

$1.025

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MKK Technologies

India . 2,229 parts In-Stock

1+ parts

$2.142

100+ parts

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2,229

$2.142

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DigiPath Technology Company

USA . 2,229 parts In-Stock

1+ parts

$2.142

100+ parts

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2,229

$2.142

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Corphita

USA . 2,022 parts In-Stock

1+ parts

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2,022

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Parana Technologies

USA . 1,895 parts In-Stock

1+ parts

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100+ parts

$1.362

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1,895

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$1.362

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GreenTree Electronics

Israel . 530 parts In-Stock

1+ parts

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530

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Kepictronics

USA . 257 parts In-Stock

1+ parts

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257

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Overview

Unlock exceptional performance in your TV and monitor applications with the STV9326 from STMicroelectronics. Renowned for its innovation, STMicroelectronics delivers unparalleled quality and reliability, ensuring that your devices operate flawlessly. The STV9326 offers superior vertical deflection control, providing smooth visuals and enhancing user experience. Trust in a leader committed to advancing technology while delivering value and durability that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product reliable for long-term use in consumer electronics.

Package Shape: RECTANGULAR

Rectangular packaging allows for efficient space utilization on PCBs, making it easier to integrate into various designs.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection, it delivers optimized performance in applications such as TVs and monitors.

Power Supplies: 29 V

A maximum power supply of 29V supports compatibility with a wide range of display systems, ensuring versatility in applications.

No. of Terminals: 7

The 7-terminal configuration provides adequate connectivity for various functions, enhancing flexibility in circuit designs.

Package Style: FLANGE MOUNT

Flange mount style provides robust mounting options, ensuring secure placement within a device.

Application: TV; MONITOR

Designed specifically for TV and monitor applications, catering to the specific needs of these devices for optimal vertical deflection.

Terminal Finish: TIN LEAD

Tin lead terminal finish guarantees excellent solderability and reliability, enhancing the longevity of the connections.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning optimizes layout options on PCBs, allowing for more efficient use of space.

Minimum Supply Voltage: 10 V

A minimum supply voltage of 10V ensures that the product can operate effectively at lower power levels, increasing its efficiency.

Technology: BIPOLAR

Bipolar technology enhances performance in analog applications, ensuring high-speed and low-power consumption.

Terminal Form: THROUGH-HOLE

Through-hole design provides strong mechanical support and better thermal performance, making it suitable for high-demand applications.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA allows for sufficient power handling, catering to the requirements of most TV and monitor circuits.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is ideal for conforming to standard PCB layouts, facilitating easier integration into existing designs.

Maximum Supply Voltage: 30 V

A maximum supply voltage of 30V allows for the operation in demanding environments, providing flexibility in various setups.

Technical Specifications

Vertical Deflection ICs STV9326 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

7

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.2,.1TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

29

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

STV9326 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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