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TDA1770A

STMicroelectronics

TDA1770A by STMicroelectronics

TDA1770A by STMicroelectronics is a Vertical Deflection IC with 25V power supply, 20 terminals in IN-LINE package. It uses BIPOLAR technology and Tin/Lead terminal finish. Ideal for CRT monitors and TV applications due to its RECTANGULAR shape and THROUGH-HOLE terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,936 parts In-Stock

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4,936

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Vyrian

USA . 4,763 parts In-Stock

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4,763

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Anansix

USA . 2,597 parts In-Stock

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2,597

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LittleDiode

UK . 50 parts In-Stock

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50

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Fibra_Brandt Electronic GMBH

Germany . 35 parts In-Stock

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35

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Electronic Expediters

USA . 15 parts In-Stock

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15

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Huijzer Components

Netherlands . 6 parts In-Stock

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6

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ECAB

Sweden . 3 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,177 parts In-Stock

1+ parts

$1.050

100+ parts

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$0.945

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2,177

$1.050

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$0.945

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MKK Technologies

India . 1,861 parts In-Stock

1+ parts

$1.974

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1,861

$1.974

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DigiPath Technology Company

USA . 1,861 parts In-Stock

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$1.974

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1,861

$1.974

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,679 parts In-Stock

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4,679

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Parana Technologies

USA . 1,099 parts In-Stock

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$1.255

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1,099

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$1.255

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Assy Fe

Spain . 15 parts In-Stock

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Overview

Get ready to elevate your electronics with the TDA1770A Vertical Deflection IC by STMicroelectronics. Known for their superior quality and cutting-edge technology, STMicroelectronics delivers top-notch products that exceed industry standards. The TDA1770A is a game-changer in the Vertical Deflection IC category, offering unmatched performance and reliability. Whether you are designing a television, monitor, or other display device, this IC will ensure crisp and clear images every time. Upgrade your project with the TDA1770A and experience the difference STMicroelectronics can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for long-term use in various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into circuit boards and ensures efficient use of space.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection applications, ensuring optimal performance in devices requiring this functionality.

Power Supplies (V): 25

Operating at 25 volts allows for sufficient power supply capacity, making it suitable for a wide range of electronic devices.

No. of Terminals: 20

A higher number of terminals provides more connection options and flexibility in circuit design.

Package Style (Meter): IN-LINE

The in-line package style simplifies PCB layout and assembly, making it easier to mount and solder.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish ensures good conductivity and solderability, enhancing the reliability of connections.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise control, making this IC suitable for demanding vertical deflection tasks.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and are suitable for applications where durability is crucial.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for standard spacing in PCB designs, facilitating easier soldering and maintenance.

Technical Specifications

Vertical Deflection ICs TDA1770A attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

25

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA1770A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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