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TDA1675A

STMicroelectronics

TDA1675A by STMicroelectronics

TDA1675A by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates with a power supply range of 24-35V, features 15 terminals in a flange mount package, and includes a blanking output. Its bipolar technology ensures reliable performance in display applications.

Median Price

$3.525

Lifecycle Status

Suppliers In-Stock

37

In-Stock Inventory

1k+

Distributors (In-Stock)

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DF Sales Co.

USA . 287 parts In-Stock

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$3.200

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287

$3.200

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DF Sales Co.

USA . 287 parts In-Stock

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$3.200

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$3.200

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Component Electronics Inc.

Canada . 86 parts In-Stock

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$3.850

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$2.880

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$2.500

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86

$3.850

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Forefront Electronics and Design

USA . 1 parts In-Stock

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$14.700

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1

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Chip Stock

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LittleDiode

UK . 1,779 parts In-Stock

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Anansix

USA . 1,709 parts In-Stock

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R&J Components

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ComSIT Distribution GmbH

Germany . 1,068 parts In-Stock

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Vyrian

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Fibra_Brandt Electronic GMBH

Germany . 519 parts In-Stock

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Electronic Expediters

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SPM Sales

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A&K Electronics

USA . 350 parts In-Stock

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350

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Rotakorn

Sweden . 350 parts In-Stock

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350

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Bristol Electronics

USA . 350 parts In-Stock

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350

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Digiode

USA . 301 parts In-Stock

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Prism Electronics

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ECAB

Sweden . 132 parts In-Stock

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Cogito LLC

Ukraine . 89 parts In-Stock

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MRC Electronics

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87

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MISTER SPROCKETS

USA . 86 parts In-Stock

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86

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Microfarads

USA . 84 parts In-Stock

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Sinequanon

UK . 38 parts In-Stock

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Lantek

USA . 25 parts In-Stock

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Cyclops Electronics Ltd

UK . 25 parts In-Stock

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25

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Mentor Electronics Marketing, LLC

USA . 20 parts In-Stock

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Halfin

Belgium . 20 parts In-Stock

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20

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Manoshevitz Elec. Sales

Israel . 18 parts In-Stock

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GES GmbH

Germany . 8 parts In-Stock

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Huijzer Components

Netherlands . 8 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 7 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 7 parts In-Stock

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Electronics Depot

USA . 6 parts In-Stock

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EMSNET

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Vectronix, Inc

USA . 4 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,614 parts In-Stock

1+ parts

$2.472

100+ parts

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$2.225

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1,614

$2.472

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$2.225

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MKK Technologies

India . 544 parts In-Stock

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$4.649

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544

$4.649

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DigiPath Technology Company

USA . 544 parts In-Stock

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$4.649

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544

$4.649

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Kepictronics

USA . 5,530 parts In-Stock

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Assy Fe

Spain . 2,907 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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2,700

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Parana Technologies

USA . 1,344 parts In-Stock

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$2.956

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1,344

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$2.956

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Corphita

USA . 645 parts In-Stock

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Infinite Electronics LLP (Excess)

. 528 parts In-Stock

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528

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Perfect Parts

USA . 274 parts In-Stock

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FE SAS

France . 48 parts In-Stock

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Overview

Unlock exceptional display performance with the TDA1675A from STMicroelectronics, a leader in innovative semiconductor solutions. This advanced vertical deflection IC ensures superior image quality for TVs and monitors, delivering reliability and efficiency. Designed with user-friendly features, it simplifies integration while providing enhanced control over display functions. Trust in ST's legacy of excellence to elevate your products and captivate your audience!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this IC suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of board space and facilitates easy integration into differing circuit designs.

General IC Type: VERTICAL DEFLECTION IC

As a vertical deflection IC, this product is specifically designed for TV and monitor applications, ensuring optimal performance in image display.

Power Supplies (V): 35

Operating at a maximum voltage of 35V provides flexibility for use in a variety of power supply configurations.

No. of Terminals: 15

With 15 terminals, this IC allows for multiple connections, enhancing its functionality and adaptability in complex circuit boards.

Package Style (Meter): FLANGE MOUNT

The flange mount style offers stability and secure attachment to the printed circuit board (PCB), improving reliability.

Application: TV; MONITOR

Tailored for use in televisions and monitors, this IC is optimized for the specific requirements of these devices, ensuring high performance.

Blanking Output: YES

The inclusion of a blanking output allows for enhanced versatility in controlling visual output, making it easier to integrate with display systems.

Terminal Finish: TIN LEAD

The tin-lead finish offers good solderability and reliability, making assembly on PCBs easier and enhancing long-term performance.

Terminal Position: ZIG-ZAG

The zig-zag terminal positioning optimizes space on the PCB while ensuring a stable connection for the IC, improving electrical performance.

Minimum Supply Voltage (Vsup): 24 V

A minimum supply voltage of 24V allows this IC to operate effectively in a wide range of applications, making it more versatile.

Technology: BIPOLAR

Utilizing bipolar technology enhances performance in analog signal processing, making it an excellent choice for applications requiring high fidelity.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides robust mechanical strength and reliable electrical connections, suitable for high-stress environments.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many applications, allowing it to fit in a variety of designs and enabling ease of assembly.

Maximum Supply Voltage (Vsup): 24 V

With a maximum supply voltage of 24V, this IC is designed for high-efficiency performance within specified voltage limits, ensuring safety and reliability.

Technical Specifications

Vertical Deflection ICs TDA1675A attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PZFM-T15

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

15

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP15,.2,.17TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

35

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

24 V

Minimum Supply Voltage (Vsup):

24 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA1675A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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