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TDA8215B

STMicroelectronics

TDA8215B by STMicroelectronics

TDA8215B by STMicroelectronics is a versatile Horiz/Vert Deflection IC designed for TV applications. It operates b/w 9-10.5V, features a max temp of 70 °C, and includes a blanking output. Its compact 20-terminal design ensures efficient performance in consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,948 parts In-Stock

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4,948

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Digiode

USA . 4,515 parts In-Stock

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Anansix

USA . 1,548 parts In-Stock

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1,548

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ACDS - Activité Composants Distribution Service

France . 1,000 parts In-Stock

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1,000

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Fibra_Brandt Electronic GMBH

Germany . 527 parts In-Stock

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527

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ComSIT Distribution GmbH

Germany . 76 parts In-Stock

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76

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LittleDiode

UK . 20 parts In-Stock

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20

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Goldney Electronics S.L.

Spain . 1 parts In-Stock

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ECAB

Sweden . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 1,977 parts In-Stock

1+ parts

$0.883

100+ parts

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$0.795

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$0.883

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$0.795

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MKK Technologies

India . 142 parts In-Stock

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$1.661

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$1.661

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DigiPath Technology Company

USA . 142 parts In-Stock

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$1.661

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$1.661

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AZTECH Wire

Italy . 1,083 parts In-Stock

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$15.650

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$15.650

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RC Electronics

USA . 24,870 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 17,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,005 parts In-Stock

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Microchip USA

USA . 6,760 parts In-Stock

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Kepictronics

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Corphita

USA . 2,848 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 1,316 parts In-Stock

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$1.056

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Cyclops Electronics Ltd (Excess)

UK . 1,000 parts In-Stock

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Glotronic Ltd.

UK . 800 parts In-Stock

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Assy Fe

Spain . 6 parts In-Stock

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Overview

Elevate your TV designs with the TDA8215B from STMicroelectronics, a trusted leader in innovative electronics. This versatile vertical deflection IC ensures superior performance and reliability, making it ideal for a range of television applications. With its robust construction and efficient power management, the TDA8215B delivers exceptional quality and longevity, empowering you to create stunning visuals while reducing maintenance costs. Harness the advantage of STMicroelectronics’ expertise and transform your entertainment experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and can withstand the operational environment commonly found in televisions.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on PCB layouts, allowing for easier integration into compact electronic designs.

General IC Type: HORIZ/VERT DEFLECTION IC

Designed specifically for horizontal and vertical deflection control, making it suitable for use in TV applications.

Power Supplies (V): 10

Operating at a standard power supply level of 10V ensures compatibility with most conventional TV designs.

No. of Terminals: 20

The 20 terminals enable various connections, facilitating complex circuitry necessary for high-quality deflection control.

Package Style (Meter): IN-LINE

In-line packaging supports easy handling and placement during manufacturing, improving production efficiency.

Application: TV

Tailored specifically for televisions, ensuring optimized performance in deflection tasks for high-quality imaging.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability under regular TV operating conditions without performance degradation.

Blanking Output: YES

Including a blanking output feature allows for effective signal handling, enhancing the quality of display during operation.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this IC performs well in a broad range of environmental conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability, ensuring robust connections and longevity in the circuit.

Terminal Position: DUAL

The dual terminal position design allows for flexible layout options on PCBs, improving design versatility.

Maximum Seated Height: 3.93 mm

A low seated height of 3.93 mm is suitable for compact designs, minimizing the overall height of the finished assembly.

Width: 7.62 mm

Having a width of 7.62 mm facilitates a compact footprint on PCBs, ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 9 V

The minimum supply voltage of 9V aligns with standard operating conditions, ensuring efficient power usage.

Temperature Grade: COMMERCIAL

As a commercial-grade component, it meets the standards for quality and reliability needed for consumer electronics.

Technology: BIPOLAR

Bipolar technology allows for high performance and efficient signal processing capabilities in deflection applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support and is easier to handle during assembly.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard for many designs, facilitating more straightforward integration into existing systems.

Maximum Supply Voltage (Vsup): 10.5 V

The tolerance for a maximum supply voltage of 10.5V allows for some flexibility in power supply design and prevents damage from overvoltage.

Technical Specifications

Vertical Deflection ICs TDA8215B attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

10

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

9 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA8215B General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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