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TDA8172

STMicroelectronics

TDA8172 by STMicroelectronics

TDA8172 by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates with a max supply voltage of 35V, features 7 terminals in a flange mount package, and utilizes bipolar technology. Its robust design ensures reliable performance in display applications.

Median Price

$5.460

Lifecycle Status

Suppliers In-Stock

39

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 850 parts In-Stock

1+ parts

$5.460

100+ parts

$2.366

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$2.239

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850

$5.460

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$2.239

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Vyrian

USA . 4,159 parts In-Stock

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Anansix

USA . 1,647 parts In-Stock

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Velocity Electronics

USA . 1,516 parts In-Stock

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Digiode

USA . 1,221 parts In-Stock

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Semi Source

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ComSIT Distribution GmbH

Germany . 807 parts In-Stock

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Lakeland Logistics Inc

USA . 800 parts In-Stock

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R&J Components

USA . 621 parts In-Stock

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Electronic Expediters

USA . 610 parts In-Stock

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610

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Q Components

USA . 554 parts In-Stock

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554

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Lantek

USA . 461 parts In-Stock

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Prism Electronics

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Goldney Electronics S.L.

Spain . 254 parts In-Stock

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Component Electronics Inc.

Canada . 245 parts In-Stock

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245

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DF Sales Co.

USA . 200 parts In-Stock

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200

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DF Sales Co.

USA . 200 parts In-Stock

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200

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MRC Electronics

USA . 150 parts In-Stock

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150

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ABC Electronics Ltd.

UK . 142 parts In-Stock

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142

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Cyclops Electronics Ltd

UK . 120 parts In-Stock

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120

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Ack Elektronik San.Tic.Ltd.Sti

. 100 parts In-Stock

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100

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Fibra_Brandt Electronic GMBH

Germany . 66 parts In-Stock

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66

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ECAB

Sweden . 58 parts In-Stock

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Inventory MP

USA . 50 parts In-Stock

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50

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Sunrise Surplus Inc.

USA . 50 parts In-Stock

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50

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Manoshevitz Elec. Sales

Israel . 50 parts In-Stock

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50

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Odyssey Electronics LTD

USA . 40 parts In-Stock

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40

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Connector Distribution Corp

USA . 31 parts In-Stock

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31

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Right Parts Inc.

USA . 31 parts In-Stock

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Huijzer Components

Netherlands . 22 parts In-Stock

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Odi Ramu Company

Canada . 21 parts In-Stock

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PC Components Company LLC

USA . 20 parts In-Stock

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20

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Corel Iberica Componentes, S.L.

Spain . 17 parts In-Stock

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Electronics Depot

USA . 10 parts In-Stock

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LittleDiode

UK . 9 parts In-Stock

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Sinequanon

UK . 8 parts In-Stock

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MISTER SPROCKETS

USA . 6 parts In-Stock

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GES GmbH

Germany . 5 parts In-Stock

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5

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Elcom Components

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,262 parts In-Stock

1+ parts

$3.045

100+ parts

-

1k+ parts

$2.741

10k+ parts

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1,262

$3.045

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$2.741

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MKK Technologies

India . 428 parts In-Stock

1+ parts

$5.726

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428

$5.726

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DigiPath Technology Company

USA . 428 parts In-Stock

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$5.726

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428

$5.726

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Authorized Procurement Solutions

USA . 50,000 parts In-Stock

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Kepictronics

USA . 27,860 parts In-Stock

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27,860

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A-Z Elektronik GmbH

Germany . 6,506 parts In-Stock

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6,506

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GreenTree Electronics

Israel . 4,553 parts In-Stock

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4,553

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Parana Technologies

USA . 2,061 parts In-Stock

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$3.641

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2,061

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$3.641

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Corphita

USA . 1,824 parts In-Stock

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1,824

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Perfect Parts

USA . 1,361 parts In-Stock

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1,361

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Cyclops Electronics Ltd (Excess)

UK . 297 parts In-Stock

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297

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Assy Fe

Spain . 280 parts In-Stock

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280

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FE SAS

France . 98 parts In-Stock

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98

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A-Plus Industry Inc.

USA . 49 parts In-Stock

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49

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Overview

Elevate your display technology with the TDA8172 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This reliable vertical deflection IC promises superior performance for TVs and monitors, ensuring vibrant visuals and smooth image stability. With robust design features that enhance durability and efficiency, the TDA8172 delivers exceptional value, making it the ideal choice for manufacturers seeking quality and performance in their products. Experience the difference with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and reliability, making the product suitable for various environmental conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit boards, optimizing space and enhancing performance.

General IC Type: VERTICAL DEFLECTION IC

Designed specifically for vertical deflection applications, ensuring efficient performance in TVs and monitors.

Power Supplies: 35 V

Operates efficiently at a maximum supply of 35 V, suitable for standard television and monitor applications.

Number of Terminals: 7

With 7 terminals, this IC provides enough connections for effective functionality while maintaining simplicity.

Package Style: FLANGE MOUNT

The flange mount design ensures secure installation and facilitates heat dissipation.

Application: TV; MONITOR

Ideal for both TV and monitor applications, ensuring versatility and widespread usability.

Terminal Finish: TIN LEAD

The tin lead finish enhances solderability and ensures reliable electrical connections.

Terminal Position: ZIG-ZAG

The zig-zag terminal position allows for better space utilization and improved circuit layout flexibility.

Minimum Supply Voltage: 35 V

Having a minimum supply voltage of 35 V indicates robustness suitable for high-performance systems.

Technology: BIPOLAR

Bipolar technology ensures fast response times and high-speed performance, making it suitable for demanding applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide stable mounting and strong mechanical connection to the circuit board.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch strikes a balance between compact design and ease of PCB design.

Maximum Supply Voltage: 35 V

Supports a maximum supply voltage of 35 V, ensuring operational reliability across a range of conditions.

Technical Specifications

Vertical Deflection ICs TDA8172 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e0

No. of Terminals:

7

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.15,.2TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

35

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

35 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA8172 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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