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TDA8146

STMicroelectronics

TDA8146 by STMicroelectronics

TDA8146 by STMicroelectronics is a versatile East-West correction IC designed for TVs and monitors. It operates b/w 15-29 V, features an 8-terminal in-line package, and withstands temperatures up to 150 °C. Ideal for enhancing display quality in consumer electronics.

Median Price

$6.117

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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TEDSS.com

USA . 50 parts In-Stock

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$5.900

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$5.900

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Bristol Electronics

USA . 575 parts In-Stock

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$6.334

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$2.744

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$2.597

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$6.334

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Digiode

USA . 1,678 parts In-Stock

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Anansix

USA . 1,258 parts In-Stock

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Lakeland Logistics Inc

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675

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Vyrian

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Zilex Electronics Inc.

Canada . 262 parts In-Stock

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Elcom Components

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ECAB

Sweden . 131 parts In-Stock

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Q Components

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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Donberg Electronics Ltd

Ireland . 85 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 56 parts In-Stock

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LittleDiode

UK . 46 parts In-Stock

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Prism Electronics

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MRC Electronics

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Huijzer Components

Netherlands . 25 parts In-Stock

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Electronic Expediters

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Corel Iberica Componentes, S.L.

Spain . 11 parts In-Stock

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ComSIT Distribution GmbH

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IDEA Electronic Components Group

UK . 1,558 parts In-Stock

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$1.624

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$1.461

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$1.624

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MKK Technologies

India . 1,186 parts In-Stock

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$3.053

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DigiPath Technology Company

USA . 1,186 parts In-Stock

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$3.053

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Kepictronics

USA . 5,000 parts In-Stock

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Corphita

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Parana Technologies

USA . 2,324 parts In-Stock

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$1.942

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Perfect Parts

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Assy Fe

Spain . 198 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

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Glotronic Ltd.

UK . 80 parts In-Stock

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Overview

Elevate your display excellence with the TDA8146 from STMicroelectronics—your go-to solution for superior vertical deflection in TVs and monitors. Renowned for their commitment to quality and innovation, STMicroelectronics delivers unmatched reliability and performance. Experience enhanced image clarity and stability while benefitting from easy integration in a compact design. Trust the TDA8146 to transform your visual technology, ensuring every viewing experience is exceptional!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides excellent protection against moisture and environmental factors, ensuring durability and reliability in various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and facilitates easy integration into existing PCB layouts.

General IC Type: EAST-WEST CORRECTION IC

Specialized for east-west correction, this IC enhances the quality of image alignment in TVs and monitors, making it ideal for video display applications.

Power Supplies (V): 24

Operating at a standard supply voltage of 24V allows compatibility with common power supply systems used in television and monitor applications.

No. of Terminals: 8

With 8 terminals, this IC ensures sufficient connectivity options while maintaining a compact design, ideal for space-constrained applications.

Package Style (Meter): IN-LINE

In-line packaging style is popular for through-hole applications, making it suitable for various circuit designs and easy soldering.

Application: TV; MONITOR

Designed specifically for televisions and monitors, this IC is optimized for video display performance, ensuring high-quality images.

Maximum Operating Temperature: 150 °C

Withstand high temperatures up to 150 °C, this IC is suitable for demanding environments, enhancing longevity and reliability.

Blanking Output: YES

The inclusion of a blanking output feature supports advanced display capabilities, improving contrast and enhancing overall visual quality.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures that the IC functions well in cooler environments without performance issues.

Terminal Finish: MATTE TIN

The matte tin finish offers good solderability and resistance to oxidation, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal position allows for a more streamlined layout, making the IC easier to integrate into designs.

Maximum Seated Height: 5.08 mm

With a low seated height of 5.08 mm, this IC can fit into tight spaces without compromising the functionality of the device.

Width: 7.62 mm

A compact width of 7.62 mm minimizes the overall footprint, making it a suitable choice for designs with limited space.

Minimum Supply Voltage (Vsup): 15 V

The minimum supply voltage of 15V ensures compatibility with a variety of power supply designs in consumer electronics.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are well-suited for prototyping and high-reliability applications.

Maximum Supply Current: 7 mA

With a maximum supply current of just 7 mA, this IC is energy-efficient, reducing overall power consumption in electronic devices.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm enhances compatibility with most circuit boards, simplifying integration and assembly.

Maximum Supply Voltage (Vsup): 29 V

Operating at a maximum supply voltage of 29V allows versatility in application while ensuring reliable performance under higher voltage conditions.

Technical Specifications

Vertical Deflection ICs TDA8146 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Deflection ICs

Maximum Supply Current:

7 mA

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA8146 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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