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E-STV9381

STMicroelectronics

E-STV9381 by STMicroelectronics

E-STV9381 by STMicroelectronics is a vertical deflection IC designed for TVs and monitors. It operates b/w 10-18 V, with a max temp of 70 °C and features a compact 20-terminal in-line package. Its BCDMOS technology ensures efficient performance in commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,761 parts In-Stock

1+ parts

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3,761

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Vyrian

USA . 1,392 parts In-Stock

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1,392

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Cyclops Electronics Ltd

UK . 519 parts In-Stock

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519

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Anansix

USA . 453 parts In-Stock

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453

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 865 parts In-Stock

1+ parts

$0.375

100+ parts

-

1k+ parts

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10k+ parts

$0.360

865

$0.375

-

-

$0.360

Northwest PG Solutions

USA . 2,073 parts In-Stock

1+ parts

$0.413

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$0.364

2,073

$0.413

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$0.364

IDEA Electronic Components Group

UK . 214 parts In-Stock

1+ parts

$2.656

100+ parts

-

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$2.390

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214

$2.656

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$2.390

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MKK Technologies

India . 1,932 parts In-Stock

1+ parts

$4.995

100+ parts

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1,932

$4.995

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DigiPath Technology Company

USA . 1,932 parts In-Stock

1+ parts

$4.995

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1,932

$4.995

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Kepictronics

USA . 7,980 parts In-Stock

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7,980

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A-Z Elektronik GmbH

Germany . 2,994 parts In-Stock

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2,994

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Alle Elektronik GmbH

Germany . 1,996 parts In-Stock

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1,996

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Corphita

USA . 1,344 parts In-Stock

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1,344

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Parana Technologies

USA . 522 parts In-Stock

1+ parts

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$3.176

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522

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$3.176

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Overview

Experience superior visual quality with the E-STV9381 Vertical Deflection IC from STMicroelectronics, a trusted leader in cutting-edge technology. Designed for TVs and monitors, this innovative solution enhances screen performance while ensuring robust durability under varying temperatures. Benefit from its reliable operation and energy efficiency, delivering crisp images and reducing power consumption. Elevate your display applications with STMicroelectronics’ commitment to excellence and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental conditions, ensuring long-term reliability in various applications.

Package Shape: RECTANGULAR

A rectangular shape allows for efficient use of PCB space and easy integration into existing designs, making it a versatile choice for manufacturers.

General IC Type: VERTICAL DEFLECTION IC

Designed specifically for vertical deflection applications, this IC optimizes performance in televisions and monitors, ensuring high-quality image display.

No. of Terminals: 20

With 20 terminals, this IC provides ample connectivity options for various circuit configurations, enhancing design flexibility.

Package Style (Meter): IN-LINE

The in-line package style enables straightforward assembly and integration into electronic systems, facilitating efficient manufacturing processes.

Application: TV; MONITOR

Tailored for TVs and monitors, this IC meets the specific needs of display technology, ensuring optimal performance in visual applications.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature rating ensures reliability in environments with varying thermal conditions, making it suited for consumer electronics.

Minimum Operating Temperature: 0 °C

The capability to operate at low temperatures expands usability in diverse climates, enhancing the product's adaptability.

Terminal Position: DUAL

Dual terminal position allows for straightforward connections in various configurations, simplifying PCB layout and assembly.

Maximum Seated Height: 5.334 mm

A low profile contributes to space-saving designs in compact electronic assemblies, making it ideal for modern, slim devices.

Width: 7.62 mm

The compact width enables integration into tighter spaces on PCBs, allowing for more efficient use of available real estate.

Minimum Supply Voltage (Vsup): 10 V

Starting with a minimum supply voltage of 10 V ensures compatibility with a variety of power supply designs, enhancing versatility.

Length: 26.162 mm

The length is designed to balance compactness with functionality, making it suitable for various electronic configurations without compromising performance.

Temperature Grade: COMMERCIAL

This temperature grade is adequate for commercial applications, ensuring performance and reliability under standard operating conditions.

Technology: BCDMOS

Using BCDMOS technology allows for efficient power management and enhanced performance, crucial for modern electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical connections, improving solder joint reliability in demanding environments.

Terminal Pitch: 2.54 mm

A standard terminal pitch facilitates compatibility with common PCB designs, streamlining the assembly process for manufacturers.

Maximum Supply Voltage (Vsup): 18 V

Supporting a maximum supply voltage of 18 V allows for flexibility in power supply design, adaptable to a range of applications.

Technical Specifications

Vertical Deflection ICs E-STV9381 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T20

Length:

26.162 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.334 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

E-STV9381 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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