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STV9380/S

STMicroelectronics

STV9380/S by STMicroelectronics

STV9380/S by STMicroelectronics is a vertical deflection IC designed for TVs and monitors, operating b/w ±12V. It features a compact 20-terminal package with a max temp of 70 °C and uses BCDMOS technology. Ideal for efficient display control in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,745

-

-

-

-

Anansix

USA . 2,016 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,016

-

-

-

-

Digiode

USA . 1,003 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,003

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,224 parts In-Stock

1+ parts

$2.093

100+ parts

-

1k+ parts

$1.884

10k+ parts

-

1,224

$2.093

-

$1.884

-

MKK Technologies

India . 2,296 parts In-Stock

1+ parts

$3.936

100+ parts

-

1k+ parts

-

10k+ parts

-

2,296

$3.936

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-

-

DigiPath Technology Company

USA . 2,296 parts In-Stock

1+ parts

$3.936

100+ parts

-

1k+ parts

-

10k+ parts

-

2,296

$3.936

-

-

-

Corphita

USA . 2,485 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

2,485

-

-

-

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Parana Technologies

USA . 47 parts In-Stock

1+ parts

-

100+ parts

$2.502

1k+ parts

-

10k+ parts

-

47

-

$2.502

-

-

Overview

Elevate your display technology with the STV9380/S from STMicroelectronics, a leader in innovative solutions. This premium Vertical Deflection IC delivers unparalleled performance for TVs and monitors, ensuring crisp visuals and reliable operation across various environments. With its robust design and proven reliability, it’s perfect for enhancing consumer electronics. Trust STMicroelectronics to power your next project with quality and efficiency that makes a difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for various applications.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient use of board space, facilitating easier integration into different designs.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection in displays, this IC optimizes performance for televisions and monitors.

Power Supplies: +-12 V

Dual power supply operation ensures versatile compatibility with different circuit designs and enhances performance reliability.

No. of Terminals: 20

The 20-terminal configuration provides ample connectivity options for improved circuit integration and functionality.

Package Style: IN-LINE

In-line package style allows for easier handling and assembly in standard circuit board manufacturing processes.

Application: TV; MONITOR

Designed for television and monitor applications, ensuring high performance and reliability in display technologies.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is capable of functioning effectively in warm environments, enhancing reliability.

Minimum Operating Temperature: 0 °C

Operating from 0 °C ensures functionality in a wide range of environmental conditions, making it suitable for diverse applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positions facilitate easy mounting and assembly on circuit boards, enhancing design flexibility.

Maximum Seated Height: 5.334 mm

A compact seated height allows for low-profile designs, optimizing space in tight circuit layouts.

Width: 7.62 mm

A width of 7.62 mm strikes a balance between compactness and connectivity, making it a versatile option for various applications.

Minimum Supply Voltage: 10 V

A minimum supply voltage of 10 V ensures compatibility with standard power supply systems while providing reliable performance.

Length: 26.162 mm

The length of 26.162 mm allows for easy integration into standard PCB layouts, optimizing design workflows.

Temperature Grade: COMMERCIAL

With a commercial temperature grade, this IC meets industry standards, ensuring reliable performance in everyday consumer electronics.

Technology: BCDMOS

BCD (Bipolar-CMOS-DMOS) technology combines the best of several technologies, resulting in high efficiency and performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust physical connections and are suitable for applications where durability is critical.

Terminal Pitch: 2.54 mm

A 2.54 mm pitch allows for easy handling and assembly, making it compatible with standard PCB designs.

Maximum Supply Voltage: 18 V

The maximum supply voltage of 18 V allows for flexibility in power supply design, accommodating a variety of circuit requirements.

Technical Specifications

Vertical Deflection ICs STV9380/S attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.162 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-12

Qualification:

Not Qualified

Maximum Seated Height:

5.334 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

STV9380/S General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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