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E-TDA8177

STMicroelectronics

E-TDA8177 by STMicroelectronics

E-TDA8177 by STMicroelectronics is a vertical deflection IC designed for efficient display applications. It operates b/w 10V and 35V, with a temperature range of -20 °C to 75°C. This 7-terminal device features a flange mount design for easy integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,718 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,718

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-

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Anansix

USA . 1,713 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1,713

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Vyrian

USA . 935 parts In-Stock

1+ parts

-

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935

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 932 parts In-Stock

1+ parts

$0.324

100+ parts

-

1k+ parts

-

10k+ parts

$0.311

932

$0.324

-

-

$0.311

Northwest PG Solutions

USA . 672 parts In-Stock

1+ parts

$0.356

100+ parts

-

1k+ parts

-

10k+ parts

$0.314

672

$0.356

-

-

$0.314

IDEA Electronic Components Group

UK . 417 parts In-Stock

1+ parts

$2.596

100+ parts

-

1k+ parts

$2.337

10k+ parts

-

417

$2.596

-

$2.337

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MKK Technologies

India . 1,394 parts In-Stock

1+ parts

$4.882

100+ parts

-

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10k+ parts

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1,394

$4.882

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DigiPath Technology Company

USA . 1,394 parts In-Stock

1+ parts

$4.882

100+ parts

-

1k+ parts

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10k+ parts

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1,394

$4.882

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Corphita

USA . 2,508 parts In-Stock

1+ parts

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2,508

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Parana Technologies

USA . 298 parts In-Stock

1+ parts

-

100+ parts

$3.104

1k+ parts

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10k+ parts

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298

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$3.104

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Overview

Elevate your display systems with the E-TDA8177 from STMicroelectronics—a leader in innovative electronic solutions. This premium Vertical Deflection IC ensures exceptional performance and reliability, catering to a wide range of applications from televisions to monitors. With its robust design and efficient operation across varied temperatures, it delivers unmatched value, enhancing image quality while simplifying integration. Experience quality and innovation that drive your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental conditions, making this IC suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCBs, facilitating easier integration into electronic designs.

General IC Type: VERTICAL DEFLECTION IC

This IC is specifically designed for vertical deflection in displays, ensuring optimal performance in television and monitor applications.

Number of Terminals: 7

With 7 terminals, this IC provides sufficient connectivity options for signal input and output, enhancing versatility in circuit design.

Package Style (Meter): FLANGE MOUNT

The flange mount style offers stable and secure installation, making it easy to integrate into various system designs.

Maximum Operating Temperature: 75 °C

A high maximum operating temperature ensures reliability and performance in environments that might experience elevated temperatures.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20 °C increases the range of applications in colder climates.

Terminal Position: ZIG-ZAG

The zig-zag terminal position optimizes the layout for better accessibility and reduces the footprint on the PCB.

Minimum Supply Voltage (Vsup): 10 V

A relatively low minimum supply voltage makes this IC adaptable for various power supply designs.

Temperature Grade: COMMERCIAL EXTENDED

Being rated as commercial extended indicates that this IC holds up well in varied environmental conditions, enhancing its applicability.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and reliability in soldered connections, making this IC suitable for more demanding applications.

Maximum Supply Voltage (Vsup): 35 V

A high maximum supply voltage allows this IC to handle significant power without failure, making it ideal for high-performance applications.

Technical Specifications

Vertical Deflection ICs E-TDA8177 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PZFM-T7

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Position:

ZIG-ZAG

Trade Compliance

E-TDA8177 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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