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TDA9115

STMicroelectronics

TDA9115 by STMicroelectronics

TDA9115 by STMicroelectronics is a versatile horiz/vert deflection IC designed for monitors. It operates b/w 10.8V and 13.2V, features a max temp of 70 °C, and has 32 terminals in a compact rectangular package. Ideal for efficient display control applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,317 parts In-Stock

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Anansix

USA . 1,506 parts In-Stock

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1,506

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Digiode

USA . 1,322 parts In-Stock

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1,322

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Cyclops Electronics Ltd

UK . 125 parts In-Stock

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125

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Odyssey Electronics LTD

USA . 13 parts In-Stock

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IDEA Electronic Components Group

UK . 1,332 parts In-Stock

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$3.480

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$3.132

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$3.480

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$3.132

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MKK Technologies

India . 1,030 parts In-Stock

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$6.545

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$6.545

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DigiPath Technology Company

USA . 1,030 parts In-Stock

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$6.545

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$6.545

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A-Z Elektronik GmbH

Germany . 7,271 parts In-Stock

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Kepictronics

USA . 3,464 parts In-Stock

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Infinite Electronics LLP (Excess)

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Corphita

USA . 1,316 parts In-Stock

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Parana Technologies

USA . 1,193 parts In-Stock

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$4.161

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$4.161

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Overview

Elevate your display technology with the TDA9115 from STMicroelectronics, a leader in innovation and reliability. This robust Vertical Deflection IC ensures crisp image clarity and stability for monitors, enhancing user experience while operating seamlessly under varied conditions. With a commitment to quality and performance, STMicroelectronics empowers businesses to deliver exceptional visual solutions, making the TDA9115 an essential choice for any advanced display application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and resistance against environmental factors, making this IC reliable for long-term use.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, which is essential for compact designs.

General IC Type: HORIZ/VERT DEFLECTION IC

This IC is specifically designed for horizontal and vertical deflection, making it highly suitable for monitor applications.

Power Supplies (V): 12

Operating at a standard 12V makes this IC compatible with widely used power supply systems.

No. of Terminals: 32

With 32 terminals, this IC provides ample connectivity options for complex designs, enhancing versatility.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch design is ideal for high-density applications, helping to save space on circuit boards.

Application: MONITOR

Designed specifically for monitor applications, this IC ensures optimal performance in display technologies.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is suited for environments with moderate heat exposure.

Blanking Output: YES

The inclusion of a blanking output enhances signal control and reduces noise, improving display performance.

Minimum Operating Temperature: 0 °C

Starting operation from 0 °C allows for use in a wider range of environmental conditions without thermal issues.

Terminal Finish: TIN LEAD

Tin-lead terminals offer good solderability and ensure reliable connections on circuit boards.

Terminal Position: DUAL

The dual terminal position provides flexibility in PCB layout design, simplifying integration into various systems.

Maximum Seated Height: 5.08 mm

With a maximum seated height of just 5.08 mm, this IC remains low-profile, accommodating space-constrained designs.

Width: 10.16 mm

A width of 10.16 mm allows for easier placement and alignment on circuit boards without requiring extensive modifications.

Minimum Supply Voltage (Vsup): 10.8 V

Operating within a minimum supply voltage of 10.8V ensures compatibility with various standard power supply systems.

Length: 27.94 mm

A length of 27.94 mm makes it suitable for various monitor designs, balancing performance with space constraints.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates reliable performance in typical operating conditions found in consumer electronics.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance mechanical stability and are advantageous for applications requiring robust connections.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm allows for sufficient spacing, making manual soldering easier and reducing assembly errors.

Maximum Supply Voltage (Vsup): 13.2 V

The ability to handle up to 13.2V ensures adaptability and robustness in various operational environments.

Technical Specifications

Vertical Deflection ICs TDA9115 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

MONITOR

Blanking Output:

YES

General IC Type:

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e0

Length:

27.94 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TDA9115 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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