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TDA9102C

STMicroelectronics

TDA9102C by STMicroelectronics

TDA9102C by STMicroelectronics is a versatile horiz/vert deflection IC designed for monitors. It operates at 12V, features a 20-terminal in-line package, and utilizes bipolar technology. Its compact size (3.93mm height, 7.62mm width) ensures efficient integration.

Median Price

$6.965

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 2 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

1k+ parts

$2.500

10k+ parts

-

2

$3.850

$2.880

$2.500

-

Bristol Electronics

USA . 680 parts In-Stock

1+ parts

$10.080

100+ parts

$4.368

1k+ parts

$4.133

10k+ parts

-

680

$10.080

$4.368

$4.133

-

Digiode

USA . 3,346 parts In-Stock

1+ parts

-

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3,346

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Vyrian

USA . 3,216 parts In-Stock

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3,216

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Anansix

USA . 1,957 parts In-Stock

1+ parts

-

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1,957

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-

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Cyclops Electronics Ltd

UK . 1,900 parts In-Stock

1+ parts

-

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1,900

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-

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,532 parts In-Stock

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1,532

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Microfarads

USA . 656 parts In-Stock

1+ parts

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656

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Huijzer Components

Netherlands . 120 parts In-Stock

1+ parts

-

100+ parts

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120

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MRC Electronics

USA . 110 parts In-Stock

1+ parts

-

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-

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110

-

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-

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Prism Electronics

USA . 104 parts In-Stock

1+ parts

-

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104

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ECAB

Sweden . 53 parts In-Stock

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53

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ACDS - Activité Composants Distribution Service

France . 43 parts In-Stock

1+ parts

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43

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Odyssey Electronics LTD

USA . 41 parts In-Stock

1+ parts

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41

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Q Components

USA . 40 parts In-Stock

1+ parts

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100+ parts

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40

-

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Fibra_Brandt Electronic GMBH

Germany . 35 parts In-Stock

1+ parts

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100+ parts

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35

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Electronic Expediters

USA . 34 parts In-Stock

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34

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Resion

USA . 28 parts In-Stock

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28

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LittleDiode

UK . 22 parts In-Stock

1+ parts

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22

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GES GmbH

Germany . 7 parts In-Stock

1+ parts

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7

-

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-

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Corel Iberica Componentes, S.L.

Spain . 7 parts In-Stock

1+ parts

-

100+ parts

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7

-

-

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Elcom Components

USA . 1 parts In-Stock

1+ parts

-

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-

1k+ parts

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1

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 375 parts In-Stock

1+ parts

$1.052

100+ parts

-

1k+ parts

$0.947

10k+ parts

-

375

$1.052

-

$0.947

-

MKK Technologies

India . 588 parts In-Stock

1+ parts

$1.979

100+ parts

-

1k+ parts

-

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588

$1.979

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DigiPath Technology Company

USA . 588 parts In-Stock

1+ parts

$1.979

100+ parts

-

1k+ parts

-

10k+ parts

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588

$1.979

-

-

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A-Z Elektronik GmbH

Germany . 7,032 parts In-Stock

1+ parts

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7,032

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-

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Kepictronics

USA . 5,614 parts In-Stock

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5,614

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 4,833 parts In-Stock

1+ parts

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4,833

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Metaverse IC Inc.

Canada . 1,900 parts In-Stock

1+ parts

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1,900

-

-

-

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Parana Technologies

USA . 675 parts In-Stock

1+ parts

-

100+ parts

$1.258

1k+ parts

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675

-

$1.258

-

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GreenTree Electronics

Israel . 610 parts In-Stock

1+ parts

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100+ parts

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610

-

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Assy Fe

Spain . 310 parts In-Stock

1+ parts

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310

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Perfect Parts

USA . 174 parts In-Stock

1+ parts

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174

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EMSNET (Excess)

USA . 5 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5

-

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-

Overview

Elevate your display solutions with the TDA9102C from STMicroelectronics, a leader in innovative technology. This vertical deflection IC guarantees exceptional quality and reliability, ensuring sharp and stable image performance for monitors. Designed with versatility in mind, it enhances visual applications while reducing power consumption. Trust in STMicroelectronics' expertise to deliver superior value and efficiency that keeps you ahead in a competitive market!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and temperature resistance, ensuring reliability in various operating conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on printed circuit boards (PCBs), making it easier to integrate into existing designs.

General IC Type: HORIZ/VERT DEFLECTION IC

As a dedicated horizontal and vertical deflection IC, it effectively manages display performance, making it ideal for monitor applications.

Power Supplies (V): 12

Operating at a 12V supply ensures compatibility with standard electronic systems, providing versatility in application.

No. of Terminals: 20

With 20 terminals, the IC accommodates a variety of connections, supporting complex functions while maintaining a compact design.

Package Style (Meter): IN-LINE

The in-line package style facilitates straightforward assembly and soldering processes, enhancing manufacturability.

Application: MONITOR

Specifically designed for monitor applications, this IC optimizes display quality and performance, making it a perfect fit for screens.

Terminal Finish: MATTE TIN

The matte tin finish provides reliable solderability and enhances the durability of the joints, ensuring longevity in devices.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options, which benefits designers looking to optimize layout and space.

Maximum Seated Height: 3.93 mm

A maximum seated height of 3.93 mm contributes to a low-profile design, aiding in the creation of slimmer and more compact electronic devices.

Width: 7.62 mm

The compact width of 7.62 mm helps in space-constrained applications, allowing for efficient placement alongside other components.

Technology: BIPOLAR

Utilizing bipolar technology ensures high-speed performance and efficient power management, essential for effective deflection control.

Terminal Form: THROUGH-HOLE

The through-hole terminal form enhances mechanical stability during soldering, making it suitable for various assembly processes.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch standardizes the design, allowing for easy integration into existing PCB layouts and simplifying prototyping.

Technical Specifications

Vertical Deflection ICs TDA9102C attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

MONITOR

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Deflection ICs

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA9102C General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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