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TDA9109A

STMicroelectronics

TDA9109A by STMicroelectronics

TDA9109A by STMicroelectronics is a Vertical Deflection IC with 32 terminals, operating voltage of 5-12V, and BICMOS technology. It is used in monitors, with a temperature range of 0-70 °C and package dimensions of 27.94mm x 10.16mm x 5.08mm (LxWxH).

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,695 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,695

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-

-

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Digiode

USA . 3,387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,387

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-

-

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Anansix

USA . 1,549 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

1,549

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-

-

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Huijzer Components

Netherlands . 210 parts In-Stock

1+ parts

-

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-

1k+ parts

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210

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,761 parts In-Stock

1+ parts

$0.889

100+ parts

-

1k+ parts

$0.800

10k+ parts

-

1,761

$0.889

-

$0.800

-

MKK Technologies

India . 1,728 parts In-Stock

1+ parts

$1.671

100+ parts

-

1k+ parts

-

10k+ parts

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1,728

$1.671

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-

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DigiPath Technology Company

USA . 1,728 parts In-Stock

1+ parts

$1.671

100+ parts

-

1k+ parts

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10k+ parts

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1,728

$1.671

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-

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Semicontronic

India . 486 parts In-Stock

1+ parts

$17.800

100+ parts

$17.355

1k+ parts

$17.266

10k+ parts

-

486

$17.800

$17.355

$17.266

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Parana Technologies

USA . 920 parts In-Stock

1+ parts

-

100+ parts

$1.063

1k+ parts

-

10k+ parts

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920

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$1.063

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Corphita

USA . 356 parts In-Stock

1+ parts

-

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356

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Overview

Elevate your monitor's performance with the TDA9109A from STMicroelectronics, a leading manufacturer known for top-quality Vertical Deflection ICs. Perfect for enhancing your viewing experience, this IC boasts a durable PLASTIC/EPOXY package and RECTANGULAR shape, ensuring reliability and longevity. With its wide range of applications in monitors, this HORIZ/VERT DEFLECTION IC offers customers unmatched value, benefits, and advantages. Upgrade your display today with the TDA9109A, delivering exceptional performance at an affordable price.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a durable and lightweight housing for the IC, making it suitable for use in a variety of applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit designs and PCB layouts.

General IC Type: HORIZ/VERT DEFLECTION IC

Specifically designed for horizontal and vertical deflection applications in monitors, ensuring optimal performance in these functions.

Power Supplies (V): 5,12

Supports power supplies of 5V and 12V, making it versatile and compatible with different systems.

No. of Terminals: 32

Provides a sufficient number of terminals for connections and interfacing with other components in the circuit.

Application: MONITOR

Tailored for use in monitors, guaranteeing reliable deflection performance in display devices.

Maximum Operating Temperature: 70 °C

Capable of operating effectively at high temperatures, ensuring stability and longevity in various environments.

Minimum Operating Temperature: 0 °C

Suitable for usage in both low and high-temperature conditions, making it adaptable to different operating environments.

Terminal Finish: TIN LEAD

The tin lead finish on the terminals provides good conductivity and solderability for easy installation and reliable connections.

Technology: BICMOS

Utilizes BICMOS technology for efficient power consumption and performance, enhancing the overall reliability of the IC.

Technical Specifications

Vertical Deflection ICs TDA9109A attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 5V SUPPLY

Application:

MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e0

Length:

27.94 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5,12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TDA9109A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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