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TDA9103S

STMicroelectronics

TDA9103S by STMicroelectronics

TDA9103S by STMicroelectronics is a versatile horiz/vert deflection IC designed for monitors. It features a compact 42-terminal design with a max height of 5.08 mm, and comes in a rectangular plastic/epoxy package. Ideal for efficient display control applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,215 parts In-Stock

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4,215

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Digiode

USA . 2,741 parts In-Stock

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2,741

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Anansix

USA . 1,101 parts In-Stock

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1,101

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,414 parts In-Stock

1+ parts

$1.620

100+ parts

-

1k+ parts

$1.458

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1,414

$1.620

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$1.458

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MKK Technologies

India . 276 parts In-Stock

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$3.047

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276

$3.047

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DigiPath Technology Company

USA . 276 parts In-Stock

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$3.047

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276

$3.047

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Kepictronics

USA . 10,140 parts In-Stock

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10,140

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Corphita

USA . 4,783 parts In-Stock

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4,783

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Parana Technologies

USA . 2,037 parts In-Stock

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$1.937

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2,037

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$1.937

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Overview

Elevate your display technology with the TDA9103S from STMicroelectronics, a trusted leader in innovative solutions. This versatile Vertical Deflection IC ensures exceptional image quality for monitors while boasting reliability and performance. Its compact design and efficient functionality make integration seamless, enhancing user experience across applications. Choose the TDA9103S to unlock superior visual precision and drive your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various environmental conditions, making this IC an excellent choice for long-term applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space efficiency on printed circuit boards, allowing for easy integration and design flexibility.

General IC Type: HORIZ/VERT DEFLECTION IC

As a specialized horizontal/vertical deflection IC, this product is tailored for precise image control in monitors, enhancing display performance.

No. of Terminals: 42

With 42 terminals, this IC offers extensive connectivity options, allowing for complex circuit designs and robust functionality.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch design minimizes space usage while facilitating efficient mounting, making it suitable for compact electronic devices.

Application: MONITOR

Designed specifically for monitor applications, this IC ensures high-quality image display, optimizing visual performance and user experience.

Terminal Position: DUAL

The dual terminal position enhances stability during installation and provides a secure connection, reducing the risk of signal loss.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm allows for compatibility with various PCB designs, enabling efficient assembly processes.

Width: 15.24 mm

With a width of 15.24 mm, this IC is compact enough to fit into tight spaces, increasing design versatility.

Length: 36.83 mm

The length of 36.83 mm provides a balance of performance and size, suitable for numerous applications without compromising functionality.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures reliable connections and ease of soldering, enhancing the overall robustness of the circuit.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm strikes a balance between compactness and ease of handling, facilitating more efficient PCB layouts.

Technical Specifications

Vertical Deflection ICs TDA9103S attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

MONITOR

General IC Type:

JESD-30 Code:

R-PDIP-T42

Length:

36.83 mm

No. of Functions:

1

No. of Terminals:

42

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TDA9103S General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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