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TDA1170D

STMicroelectronics

TDA1170D by STMicroelectronics

TDA1170D by STMicroelectronics is a Vertical Deflection IC with 16 terminals, operating voltage of 22-25V. It is used in TV and monitor applications, featuring bipolar technology and through-hole terminal form.

Median Price

$3.610

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 2 parts In-Stock

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$3.610

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Digiode

USA . 3,635 parts In-Stock

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Anansix

USA . 2,289 parts In-Stock

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Vyrian

USA . 1,805 parts In-Stock

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ECAB

Sweden . 896 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 192 parts In-Stock

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LittleDiode

UK . 137 parts In-Stock

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Huijzer Components

Netherlands . 49 parts In-Stock

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GES GmbH

Germany . 23 parts In-Stock

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Electronics Depot

USA . 8 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 5 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 141 parts In-Stock

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$2.994

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$2.694

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141

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$2.694

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MKK Technologies

India . 1,607 parts In-Stock

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$5.629

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DigiPath Technology Company

USA . 1,607 parts In-Stock

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Corphita

USA . 4,120 parts In-Stock

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Assy Fe

Spain . 562 parts In-Stock

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Parana Technologies

USA . 475 parts In-Stock

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$3.579

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Perfect Parts

USA . 430 parts In-Stock

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Kepictronics

USA . 400 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 192 parts In-Stock

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Glotronic Ltd.

UK . 154 parts In-Stock

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Overview

Unlock the full potential of your TV or monitor with the TDA1170D Vertical Deflection IC by STMicroelectronics. Manufactured with precision and expertise, this high-quality IC offers unmatched reliability and performance. Designed for vertical deflection applications, this IC ensures smooth and stable operation, delivering crisp and clear images. Trust in STMicroelectronics to provide you with cutting-edge technology that enhances your viewing experience. Upgrade your device today with the TDA1170D and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability for long-term use.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into electronic devices.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection applications in TVs and monitors, ensuring optimal performance.

Power Supplies (V): 25

Operating at a power supply of 25V ensures compatibility with various electronic systems.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options in different circuit configurations.

Package Style (Meter): IN-LINE

In-line package style makes it easy to mount and connect within electronic devices.

Application: TV; MONITOR

Suitable for use in TVs and monitors, covering a wide range of electronic products.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good conductivity and prevents corrosion for long-lasting performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and layout.

Minimum Supply Voltage (Vsup): 22 V

With a minimum supply voltage of 22V, this IC can operate efficiently within specified voltage ranges.

Technology: BIPOLAR

Utilizing bipolar technology ensures stable and reliable performance in vertical deflection applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers secure mounting and soldering capabilities in electronic assemblies.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54mm allows for easy connections and compatibility with standard PCB layouts.

Maximum Supply Voltage (Vsup): 22 V

Operating within a maximum supply voltage of 22V ensures safety and protection for the IC.

Technical Specifications

Vertical Deflection ICs TDA1170D attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

25

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

22 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA1170D General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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