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TEA2029C

STMicroelectronics

TEA2029C by STMicroelectronics

TEA2029C by STMicroelectronics is a versatile HORIZ/VERT deflection IC designed for TV applications. It features a 28-terminal in-line package, operates at a min supply voltage of 12V, and supports a max current of 80mA. Its robust plastic/epoxy construction ensures durability.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,876 parts In-Stock

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3,876

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Anansix

USA . 1,043 parts In-Stock

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1,043

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Vyrian

USA . 1,043 parts In-Stock

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1,043

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LIBRA Elektronik GmbH

Germany . 58 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 15 parts In-Stock

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ECAB

Sweden . 15 parts In-Stock

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Q Components

USA . 13 parts In-Stock

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LittleDiode

UK . 8 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 4 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 2 parts In-Stock

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Huijzer Components

Netherlands . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,266 parts In-Stock

1+ parts

$1.317

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$1.186

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MKK Technologies

India . 2,252 parts In-Stock

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$2.477

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DigiPath Technology Company

USA . 2,252 parts In-Stock

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$2.477

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Parana Technologies

USA . 1,985 parts In-Stock

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$1.575

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1,985

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Corphita

USA . 77 parts In-Stock

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Assy Fe

Spain . 9 parts In-Stock

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Overview

Elevate your TV designs with the TEA2029C from STMicroelectronics, a trusted leader in innovative electronics. This versatile vertical deflection IC ensures exceptional performance and reliability, bringing stunning visuals to life. With easy integration and robust construction, it’s ideal for enhancing television displays. Choose TEA2029C for superior quality and experience seamless operation, ensuring your customers enjoy the ultimate viewing experience!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this IC reliable for long-term use in consumer electronics.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on printed circuit boards, enabling easier integration into various designs.

General IC Type: HORIZ/VERT DEFLECTION IC

This specific versatility makes it suitable for both horizontal and vertical deflection applications, providing manufacturers with design flexibility.

No. of Terminals: 28

With 28 terminals, this IC supports a wide range of connections, facilitating complex circuit designs in TV applications.

Package Style (Meter): IN-LINE

The in-line package style simplifies the assembly process and enhances the product's compatibility with automatic insertion machinery.

Application: TV

Designed specifically for TV applications, this IC meets the demands of image stability and quality expected in modern displays.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures excellent solderability and reliability in connections, which is crucial for maintaining the performance of electronic devices.

Terminal Position: DUAL

The dual terminal position allows for convenient mounting and enhances the design layout options within electronic systems.

Minimum Supply Voltage (Vsup): 12 V

A minimum supply voltage of 12 V allows for efficient operation within established power supply standards used in television circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide mechanical stability and reliable connections, making the IC suitable for demanding applications.

Maximum Supply Current: 80 mA

Handling a maximum supply current of 80 mA ensures sufficient power for the deflection requirements of typical television circuits.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard, making it compatible with most PCB layouts and enhancing design scalability.

Maximum Supply Voltage (Vsup): 12 V

With a maximum supply voltage of 12 V, this IC operates efficiently within common limits, ensuring safe and stable performance.

Technical Specifications

Vertical Deflection ICs TEA2029C attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

80 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TEA2029C General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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