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TDA8178FS

STMicroelectronics

TDA8178FS by STMicroelectronics

TDA8178FS by STMicroelectronics is a Vertical Deflection IC with 7 terminals, operating voltage range of 10-48V. It is used in TV and monitor applications, with temperature range from 0 to 150 °C. Package style is flange mount, terminal finish is tin lead, and pitch is 1.27mm for through-hole mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,133 parts In-Stock

1+ parts

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2,133

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Anansix

USA . 634 parts In-Stock

1+ parts

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634

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Digiode

USA . 140 parts In-Stock

1+ parts

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140

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ECAB

Sweden . 52 parts In-Stock

1+ parts

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-

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52

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LittleDiode

UK . 1 parts In-Stock

1+ parts

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100+ parts

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,970 parts In-Stock

1+ parts

$3.544

100+ parts

-

1k+ parts

$3.189

10k+ parts

-

1,970

$3.544

-

$3.189

-

MKK Technologies

India . 118 parts In-Stock

1+ parts

$6.664

100+ parts

-

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118

$6.664

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DigiPath Technology Company

USA . 118 parts In-Stock

1+ parts

$6.664

100+ parts

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118

$6.664

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Corphita

USA . 4,605 parts In-Stock

1+ parts

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4,605

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Parana Technologies

USA . 421 parts In-Stock

1+ parts

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100+ parts

$4.237

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421

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$4.237

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Assy Fe

Spain . 5 parts In-Stock

1+ parts

-

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5

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Overview

Unlock the full potential of your TV or monitor with the TDA8178FS Vertical Deflection IC by STMicroelectronics. With a reputation for high-quality manufacturing, STMicroelectronics delivers a superior product that guarantees reliable performance and durability. This vertical deflection IC offers unmatched value, providing efficient power supplies and a wide operating temperature range. Experience crisp, clear images and seamless functionality in your electronic devices with the TDA8178FS. Trust STMicroelectronics to elevate your viewing experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

General IC Type: VERTICAL DEFLECTION IC

Specifically designed for vertical deflection applications in TVs and monitors, ensuring optimal performance.

Power Supplies (V): 10/48

Supports power supplies ranging from 10V to 48V, making it versatile for different system requirements.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy mounting and integration into electronic systems.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, ensuring reliability under various operating conditions.

Minimum Operating Temperature: 0 °C

Can perform in cold environments without any issues, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity for reliable connections.

Terminal Position: ZIG-ZAG

Zig-zag terminal position aids in efficient routing of connections, optimizing PCB layout and space utilization.

Minimum Supply Voltage (Vsup): 10 V

Can function effectively with a minimum supply voltage of 10V, suitable for low-power operations.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures secure and stable connections on the PCB, reducing the risk of disconnection.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and compact PCB layout, enhancing overall system design.

Maximum Supply Voltage (Vsup): 42 V

Capable of handling a maximum supply voltage of 42V, providing flexibility in power input options.

Technical Specifications

Vertical Deflection ICs TDA8178FS attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.15,.2TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

10/48

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

42 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA8178FS General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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