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TDA2170

STMicroelectronics

TDA2170 by STMicroelectronics

TDA2170 by STMicroelectronics is a Vertical Deflection IC with 11 terminals, operating at 35V. It has a PLASTIC/EPOXY body in RECTANGULAR shape and FLANGE MOUNT style. Ideal for TV and monitor applications due to its BIPOLAR technology and ZIG-ZAG terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,392 parts In-Stock

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3,392

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Digiode

USA . 1,817 parts In-Stock

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1,817

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Anansix

USA . 775 parts In-Stock

1+ parts

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775

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ECAB

Sweden . 278 parts In-Stock

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278

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Kronex Distribution GmbH

USA . 175 parts In-Stock

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175

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Electronics Depot

USA . 45 parts In-Stock

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45

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LittleDiode

UK . 37 parts In-Stock

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37

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ACDS - Activité Composants Distribution Service

France . 7 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 242 parts In-Stock

1+ parts

$0.784

100+ parts

-

1k+ parts

$0.705

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242

$0.784

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$0.705

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MKK Technologies

India . 1,482 parts In-Stock

1+ parts

$1.474

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1,482

$1.474

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DigiPath Technology Company

USA . 1,482 parts In-Stock

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$1.474

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1,482

$1.474

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Parana Technologies

USA . 2,268 parts In-Stock

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$0.937

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2,268

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$0.937

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Corphita

USA . 365 parts In-Stock

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365

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Assy Fe

Spain . 5 parts In-Stock

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5

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Overview

Unlock the power of superior vertical deflection with the TDA2170 by STMicroelectronics. Designed with precision and quality in mind, this Vertical Deflection IC offers unmatched performance for TV and monitor applications. With a maximum supply voltage of 35V, this product ensures reliability and efficiency in every use. Elevate your viewing experience with the TDA2170 and experience the difference that only STMicroelectronics can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps protect the internal components of the IC, ensuring long-lasting performance.

Power Supplies (V): 35

With a power supply voltage of 35V, this IC can handle high power requirements, making it suitable for use in TV and monitor applications.

No. of Terminals: 11

Having 11 terminals allows for a variety of connections and flexibility in circuit design.

Technology: BIPOLAR

Bipolar technology offers high power handling capability and reliability, making this IC a robust choice for vertical deflection applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style makes installation and replacement easy, reducing maintenance time and costs.

Maximum Supply Voltage (Vsup): 35 V

With a maximum supply voltage of 35V, this IC is capable of handling high voltage levels, providing a reliable performance in various applications.

Technical Specifications

Vertical Deflection ICs TDA2170 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV; MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T11

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

11

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP11,.2,.17,67TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

35

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

35 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA2170 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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