Loading...

TEA2130

STMicroelectronics

TEA2130 by STMicroelectronics

TEA2130 by STMicroelectronics is a bipolar IC designed for horizontal and vertical deflection in TVs. It operates at a supply voltage of 12V, features 20 terminals, and withstands temperatures from 0 °C to 70°C. Its compact rectangular package ensures efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,642

-

-

-

-

Anansix

USA . 594 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

594

-

-

-

-

Electronic Expediters

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Vyrian

USA . 94 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

94

-

-

-

-

Resion

USA . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

LittleDiode

UK . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,842 parts In-Stock

1+ parts

$1.976

100+ parts

-

1k+ parts

$1.779

10k+ parts

-

1,842

$1.976

-

$1.779

-

MKK Technologies

India . 171 parts In-Stock

1+ parts

$3.716

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$3.716

-

-

-

DigiPath Technology Company

USA . 171 parts In-Stock

1+ parts

$3.716

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$3.716

-

-

-

Authorized Procurement Solutions

USA . 64,728 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

64,728

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,285

-

-

-

-

Corphita

USA . 3,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,036

-

-

-

-

Assy Fe

Spain . 1,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,959

-

-

-

-

Perfect Parts

USA . 494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

494

-

-

-

-

GreenTree Electronics

Israel . 441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

441

-

-

-

-

Parana Technologies

USA . 31 parts In-Stock

1+ parts

-

100+ parts

$2.363

1k+ parts

-

10k+ parts

-

31

-

$2.363

-

-

Overview

Elevate your TV designs with the TEA2130 from STMicroelectronics—a trusted leader in innovative solutions. This versatile vertical deflection IC not only ensures crystal-clear picture quality but also offers exceptional reliability and performance, thanks to ST's commitment to excellence. Ideal for enhancing consumer electronics, the TEA2130 enhances viewing experiences while streamlining production processes. Unlock the potential of your applications with this premium component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making it suitable for long-term applications in consumer electronics.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on circuit boards, which can be advantageous when designing compact electronic systems.

General IC Type: HORIZ/VERT DEFLECTION IC

Designed specifically for horizontal and vertical deflection applications, this IC is well-suited for TV and display technologies, ensuring optimal performance in visual applications.

Power Supplies (V): 12

Operating at a standard 12V makes this IC compatible with a wide range of power supplies, ensuring ease of integration into existing designs.

No. of Terminals: 20

The 20 terminals provide ample connection points for various functions, enhancing flexibility in circuit design and allowing for complex integrations.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy mounting on PCB layouts, promoting efficient manufacturing and assembly processes.

Application: TV

Specifically designed for television applications, this IC delivers reliable performance for both analog and digital displays, appealing to manufacturers in the consumer electronics market.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can function effectively in various environments, providing peace of mind in thermal management during operation.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures that the IC can withstand colder environments, making it versatile for different geographical markets.

Terminal Finish: TIN LEAD

Tin-lead terminal finish aids in solderability, ensuring reliable and durable connections in electronic assemblies.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout options, facilitating efficient circuit design and integration.

Maximum Seated Height: 3.93 mm

The compact seated height of 3.93 mm helps save space in designs, making it ideal for thin-profile electronics.

Width: 7.62 mm

A width of 7.62 mm strikes a balance between functionality and compactness, providing design engineers with versatility while ensuring performance.

Minimum Supply Voltage (Vsup): 12 V

A minimum supply voltage of 12V establishes a standard voltage operation, enhancing compatibility with existing power systems.

Temperature Grade: COMMERCIAL

Labeled as a commercial-grade temperature component, it assures quality and reliability for consumer-grade electronics.

Technology: BIPOLAR

The bipolar technology utilized in this IC provides fast switching times and efficient performance, essential for high-quality display outputs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form facilitates robust mechanical stability and easy assembly, making it ideal for prototyping and production runs.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm aligns with standard PCB designs, offering ease of integration and compatibility with most PCB manufacturing processes.

Maximum Supply Voltage (Vsup): 12 V

Consistent with its minimum supply voltage, the maximum of 12V ensures stable operation across various load conditions, enhancing overall reliability.

Technical Specifications

Vertical Deflection ICs TEA2130 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

TV

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TEA2130 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7