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TEA2117

STMicroelectronics

TEA2117 by STMicroelectronics

TEA2117 by STMicroelectronics is a bipolar horiz/vert deflection IC designed for monitors. It operates with a supply voltage range of 8-20V and features 15 terminals in a flange mount, ensuring reliable performance in display applications. Its rectangular plastic/epoxy package enhances durability.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,642 parts In-Stock

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Vyrian

USA . 2,529 parts In-Stock

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2,529

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Anansix

USA . 425 parts In-Stock

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425

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LittleDiode

UK . 14 parts In-Stock

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ECAB

Sweden . 9 parts In-Stock

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GES GmbH

Germany . 4 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 187 parts In-Stock

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$0.796

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$0.716

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187

$0.796

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$0.716

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MKK Technologies

India . 427 parts In-Stock

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$1.496

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427

$1.496

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DigiPath Technology Company

USA . 427 parts In-Stock

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$1.496

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427

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Corphita

USA . 4,545 parts In-Stock

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4,545

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Parana Technologies

USA . 2,097 parts In-Stock

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$0.952

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Kepictronics

USA . 1,200 parts In-Stock

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Overview

Elevate your display systems with the TEA2117 from STMicroelectronics, a trusted leader in cutting-edge semiconductor solutions. Designed for superior vertical deflection in monitors, this robust IC ensures crystal-clear image quality and reliability. With its durable plastic-epoxy package and versatile applications, the TEA2117 delivers unmatched performance and efficiency, empowering you to create stunning visual experiences that captivate audiences. Enhance your projects with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, ensuring long-lasting performance in various operating conditions.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, making it easier to integrate into compact designs, which is essential for modern electronics.

General IC Type: HORIZ/VERT DEFLECTION IC

Designed specifically for horizontal and vertical deflection applications, this IC ensures precise and efficient movement control in displays, enhancing image quality.

Power Supplies: 10 V

Operating at a nominal supply voltage of 10V provides flexibility and compatibility with a wide range of electronic systems.

No. of Terminals: 15

With 15 terminals, this IC supports comprehensive connectivity options, enabling versatile circuit designs tailored to specific applications.

Package Style: FLANGE MOUNT

The flange mount style offers stable mounting options, ensuring secure placement in various devices, reducing risks of mechanical failure during use.

Application: MONITOR

Optimized for monitor applications, this IC is tailored to deliver high-performance visuals, making it an excellent choice for display technologies.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides reliable electrical connections and improves solderability, contributing to better assembly processes.

Terminal Position: ZIG-ZAG

The zig-zag terminal arrangement facilitates easier PCB layout and routing, enhancing the overall design efficiency of electronic projects.

Minimum Supply Voltage: 8 V

A minimum supply voltage of 8V ensures operation in lower voltage environments, broadening the range of applications for this IC.

Technology: BIPOLAR

Utilizing bipolar technology enhances speed and performance, making this IC suitable for high-frequency applications with minimal distortion.

Terminal Form: THROUGH-HOLE

Through-hole terminal form facilitates robust mechanical support and ease of handling during assembly and manufacturing.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for a compact design, suitable for high-density applications, making it perfect for modern electronic devices.

Maximum Supply Voltage: 20 V

With a maximum supply voltage of 20V, this IC can efficiently handle various power requirements, ensuring reliability in varied applications.

Technical Specifications

Vertical Deflection ICs TEA2117 attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

Application:

MONITOR

Blanking Output:

NO

General IC Type:

JESD-30 Code:

R-PZFM-T15

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

15

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP15,.2,.17TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

10

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TEA2117 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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