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TDA8147M

STMicroelectronics

TDA8147M by STMicroelectronics

TDA8147M by STMicroelectronics is a Vertical Deflection IC with 24V power supply, 8 terminals, and max operating temp of 150 °C. It's an EAST-WEST CORRECTION IC used in TV applications for correcting vertical deflection issues efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,785 parts In-Stock

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2,785

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Anansix

USA . 2,666 parts In-Stock

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2,666

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Digiode

USA . 1,194 parts In-Stock

1+ parts

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1,194

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ECAB

Sweden . 586 parts In-Stock

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586

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,247 parts In-Stock

1+ parts

$1.536

100+ parts

-

1k+ parts

$1.383

10k+ parts

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1,247

$1.536

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$1.383

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MKK Technologies

India . 71 parts In-Stock

1+ parts

$2.889

100+ parts

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71

$2.889

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DigiPath Technology Company

USA . 71 parts In-Stock

1+ parts

$2.889

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71

$2.889

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Corphita

USA . 3,363 parts In-Stock

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3,363

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Parana Technologies

USA . 1,386 parts In-Stock

1+ parts

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100+ parts

$1.837

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1,386

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$1.837

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Overview

Elevate your viewing experience with the TDA8147M by STMicroelectronics. As a leading manufacturer in vertical deflection ICs, STMicroelectronics delivers unrivaled quality and reliability. This EAST-WEST CORRECTION IC provides seamless horizontal correction for optimal image clarity. With a power supply of 24V and dual terminal position, this IC is versatile and efficient for a wide range of applications. Trust in STMicroelectronics to enhance your electronics with cutting-edge technology and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and durability.

Package Shape: RECTANGULAR

Compact design allows for easy integration into various electronic devices and circuit boards.

General IC Type: EAST-WEST CORRECTION IC

Specifically designed for vertical deflection applications, ensuring optimal performance in display devices.

Power Supplies (V): 24

Suitable voltage level for vertical deflection applications, providing stable operation.

No. of Terminals: 8

Adequate number of terminals for connections, making it easy to install and use in circuits.

Package Style (Meter): IN-LINE

Easily fits in standard meter sockets, allowing for seamless integration into metering devices.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without compromising performance.

Minimum Operating Temperature: -25 °C

Can also operate in low-temperature conditions, providing versatility in various operating environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides reliable electrical connections and solderability for easy assembly.

Terminal Position: DUAL

Dual terminal positions offer flexibility in installation and connection options.

Technology: BIPOLAR

Bipolar technology ensures efficient vertical deflection capabilities in display applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals allow for secure mounting on circuit boards, ensuring stability during operation.

Maximum Supply Current: 7 mA

Low supply current requirement helps in reducing power consumption and heat generation.

Terminal Pitch: 2.54 mm

Standard terminal pitch enables easy connection to other components and circuit boards.

Technical Specifications

Vertical Deflection ICs TDA8147M attributes and parameters. Explore more Vertical Deflection ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Maximum Supply Current:

7 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA8147M General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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