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TDA8351AQ

NXP Semiconductors

TDA8351AQ by NXP Semiconductors

TDA8351AQ from NXP Semiconductors is a vertical deflection IC designed for efficient performance in display applications. It operates on power supplies of 9/25V, features a max temp of 70 °C, and has 13 terminals in a zig-zag layout. Ideal for TVs and monitors, it ensures reliable image stability.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,377 parts In-Stock

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Anansix

USA . 2,703 parts In-Stock

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Digiode

USA . 1,781 parts In-Stock

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ABC Electronics Ltd.

UK . 90 parts In-Stock

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90

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ACDS - Activité Composants Distribution Service

France . 31 parts In-Stock

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Goldney Electronics S.L.

Spain . 11 parts In-Stock

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LittleDiode

UK . 5 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 375 parts In-Stock

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$7.800

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Kepictronics

USA . 4,100 parts In-Stock

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Corphita

USA . 3,496 parts In-Stock

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UNI Independent Distributors

Spain . 1,164 parts In-Stock

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Assy Fe

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Overview

Experience unparalleled performance with the TDA8351AQ from NXP Semiconductors, a trusted leader in innovation. This Vertical Deflection IC is designed to deliver exceptional quality and reliability across diverse applications, from televisions to monitors. With superior thermal resilience and easy integration, it enhances your product's efficiency while ensuring robust operation in challenging environments. Elevate your designs with NXP's commitment to excellence—where quality meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides excellent durability and resistance to environmental factors, ensuring reliable performance in various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it easier to integrate into compact designs.

General IC Type: VERTICAL DEFLECTION IC

Designed specifically for vertical deflection applications, this IC provides precise control over display rendering, making it ideal for CRT and other display technologies.

Power Supplies (V): 9/25

The flexibility of operating on dual power supplies (9V and 25V) allows for a wide range of applications, accommodating various system requirements.

No. of Terminals: 13

With 13 terminals, the IC provides a robust connection interface, supporting complex functionality while ensuring ease of integration into electronic designs.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy handling and placement during assembly, improving manufacturing efficiency.

Maximum Operating Temperature: 70 °C

Operating safely up to 70 °C ensures reliable performance in higher temperature conditions, making it suitable for a variety of environments.

Minimum Operating Temperature: -25 °C

The ability to function in temperatures as low as -25 °C enables this IC to operate in challenging cold environments, expanding its application range.

Terminal Position: ZIG-ZAG

The zig-zag terminal position optimizes space on the PCB, allowing for denser designs without compromising on connectivity or accessibility.

Technology: BIPOLAR

Bipolar technology allows for high-speed operation and strong performance characteristics, making this IC suitable for demanding applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust electrical connections and ease of soldering, enhancing reliability in mechanical stability.

Terminal Pitch: 1.7 mm

A terminal pitch of 1.7 mm strikes a balance between ease of installation and compatibility with various PCB designs, making it versatile for different applications.

Technical Specifications

Vertical Deflection ICs TDA8351AQ attributes and parameters. Explore more Vertical Deflection ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T13

No. of Terminals:

13

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP13,.2,.17,67

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

9/25

Qualification:

Not Qualified

Sub-Category:

Deflection ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA8351AQ General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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